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september 2006 order number: d56021-001us the intel ? desktop board DQ965GF may contain design defects or errors known as errata that may cause the product to deviate from publishe d specifications. current characterized errata are documented in the in tel desktop board DQ965GF specification update. intel? desktop board DQ965GF technical product specification
revision history revision revision history date -001 first release of the intel ? desktop board DQ965GF technical product specification. september 2006 this product specification applies to only the standard intel ? desktop board DQ965GF with bios identifier co96510j.86a. changes to this specification w ill be published in the intel de sktop board DQ965GF specification update before being incorporated into a revision of this document. information in this document is pr ovided in connection with intel ? products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. exce pt as provided in intel?s term s and conditions of sale for such products, intel assumes no liability what soever, and intel disclaims any express or implied warranty, relating to sale and/or us e of intel products in cluding liability or warranties relating to fitness for a particul ar purpose, merchantabi lity, or infringement of any patent, copyright or other intellectu al property right. in tel products are not intended for use in medical, life saving , or life sustaining applications. intel corporation may have patents or pending pate nt applications, trademar ks, copyrights, or other intellectual property rights that relate to the pres ented subject matter. the furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. intel may make changes to specifications and pr oduct descriptions at any time, without notice. designers must not rely on the absence or characteristi cs of any features or instru ctions marked ?reserved? or ?undefined.? intel reserves these for future defini tion and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. intel ? desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. current characterized errata are available on request. contact your local intel sales office or your distributor to obtain the latest specifications before placing your product order. copies of documents which have an ordering number and are referenced in this document, or other intel literature, may be obtained from: intel corporation p.o. box 5937 denver, co 80217-9808 or call in north america 1-800-548-4725, europe 44-0-1793-431-155, france 44-0-1793-421-777, germany 44-0-1793-421-333, other countries 708-296-9333. intel, the intel logo, pentium, and celeron are registered trademarks of intel corporation or its subsidiaries in the united states and other countries. * other names and brands may be clai med as the property of others. copyright ? 2006, intel corporation. all rights reserved.
iii preface this technical product specification (tps) specifies the board layout, components, connectors, power and environmental requ irements, and the bios for the intel ? desktop board DQ965GF. it describes the standard product and available manufacturing options. intended audience the tps is intended to provide detailed, technical information about the desktop board DQ965GF and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. it is specifically not intended for general audiences. what this document contains chapter description 1 a description of the hardware used on the board 2 a map of the resources of the board 3 the features supported by the bios setup program 4 a description of the bios error me ssages, beep codes, and post codes 5 regulatory compliance and battery disposal information typographical conventions this section contains information about the conventions used in this specification. not all of these symbols and abbreviations appear in all specifications of this type. notes, cautions, and warnings note notes call attention to important information. # integrator?s notes integrator?s notes are used to call attentio n to information that may be useful to system integrators. caution cautions are included to help you avoi d damaging hardware or losing data.
intel desktop board DQ965GF tec hnical product specification iv other common notation # used after a signal name to identify an active-low signal (such as usbp0#). gb gigabyte (1,073,741,824 bytes) gb/sec gigabytes per second gbit gigabit (1, 073,741,824 bits) kb kilobyte (1024 bytes) kbit kilobit (1024 bits) kbits/sec 1000 bits per second mb megabyte (1,048,576 bytes) mb/sec megabytes per second mbit megabit (1,048,576 bits) mbit/sec megabits per second xxh an address or data value ending with a lowercase h indicates a hexadecimal value. x.x v volts. voltages are dc unless otherwise specified. * this symbol is used to indicate third-party brands and names that are the property of their respective owners.
v contents 1 product description 1.1 overview........................................................................................ 12 1.1.1 feature summary ................................................................ 12 1.1.2 manufacturing options .......................................................... 13 1.1.3 board layout ....................................................................... 14 1.1.4 block diagram ..................................................................... 16 1.2 online support................................................................................ 17 1.3 processor ....................................................................................... 17 1.4 system memory .............................................................................. 18 1.4.1 memory configurations ......... ................................................ 20 1.5 intel ? virtualization technology (intel ? vt) ........................................ 26 1.6 intel ? vpro? technology support ...................................................... 27 1.7 intel ? q965 express chipset ............................................................. 28 1.7.1 intel q965 graphics subsystem.............................................. 28 1.7.2 usb ................................................................................... 30 1.7.3 serial ata interfaces ............................................................ 31 1.7.4 parallel ide interface ............................................................ 32 1.7.5 real-time clock, cmos sram, and battery .............................. 32 1.8 legacy i/o controller ....................................................................... 33 1.8.1 serial port interface............ .................................................. 33 1.8.2 parallel port interface ........................................................... 33 1.8.3 diskette drive interface ........ ................................................ 33 1.8.4 ps/2 keyboard and mouse interface (optional) ......................... 33 1.9 audio subsystem............................................................................. 34 1.9.1 audio subsystem software .................................................... 34 1.9.2 audio connectors and headers ............................................... 35 1.10 lan subsystem ............................................................................... 36 1.10.1 intel ? 82566dm gigabit ethernet controller ............................. 36 1.10.2 lan subsystem software....................................................... 36 1.10.3 rj-45 lan connector with integrated leds .............................. 37 1.10.4 intel ? active management technology (intel ? amt) with system defense feature........................................................ 37 1.10.5 alert standard format (asf) 2.0 support................................. 38 1.11 hardware management subsystem .................................................... 39 1.11.1 hardware monitoring and fan control...................................... 39 1.11.2 fan monitoring ..................................................................... 39 1.11.3 chassis intrusion and detection.............................................. 39 1.11.4 thermal monitoring .............................................................. 40 1.12 power management ......................................................................... 41 1.12.1 acpi .................................................................................. 41 1.12.2 hardware support ................................................................ 43 1.13 trusted platform module (tpm)..... ..................................................... 48
intel desktop board DQ965GF tec hnical product specification vi 2 technical reference 2.1 memory map................................................................................... 49 2.1.1 addressable memory............................................................. 49 2.2 dma channels................................................................................. 51 2.3 fixed i/o map ................................................................................. 52 2.4 pci configuration space map .......... .................................................. 53 2.5 interrupts ...................................................................................... 54 2.6 pci interrupt routing map ................................................................ 55 2.7 connectors and headers................................................................... 56 2.7.1 back panel connectors .......................................................... 57 2.7.2 component-side connectors and headers ................................ 58 2.8 jumper block .................................................................................. 67 2.9 mechanical considerations ........... ..................................................... 68 2.9.1 form factor......................................................................... 68 2.9.2 i/o shield ........................................................................... 69 2.10 electrical considerations ........... ........................................................ 73 2.10.1 dc loading.......................................................................... 73 2.10.2 fan header current capability................................................ 73 2.10.3 add-in board considerations .. ................................................ 74 2.10.4 power supply considerations ................................................. 74 2.11 thermal considerations .................................................................... 75 2.12 reliability ....................................................................................... 77 2.13 environmental ................................................................................ 78 3 overview of bios features 3.1 introduction ................................................................................... 79 3.2 bios flash memory organization .. ..................................................... 80 3.3 resource configuration ............ ........................................................ 80 3.3.1 pci autoconfiguration ........................................................... 80 3.3.2 pci ide support................................................................... 81 3.4 system management bios (smbios)................................................. 81 3.5 legacy usb support ........................................................................ 82 3.6 bios updates ................................................................................. 82 3.6.1 language support ................................................................ 83 3.6.2 custom splash screen .......................................................... 83 3.7 bios recovery................................................................................ 83 3.8 boot options................................................................................... 84 3.8.1 cd-rom boot ...................................................................... 84 3.8.2 network boot....................................................................... 84 3.8.3 booting without attached devices........................................... 84 3.8.4 changing the default boot device during post ........................ 84 3.9 adjusting boot speed....................................................................... 85 3.9.1 peripheral selection and conf iguration..................................... 85 3.9.2 bios boot optimizations ....... ................................................ 85 3.10 bios security features .................................................................... 86
contents vii 4 error messages and beep codes 4.1 speaker ......................................................................................... 87 4.2 bios beep codes ............................................................................ 87 4.3 bios error messages ....................................................................... 87 4.4 port 80h post codes ....................................................................... 88 5 regulatory compliance and battery disposal information 5.1 regulatory compliance..................................................................... 93 5.1.1 safety regulations................................................................ 93 5.1.2 european union declaration of conformity statement ................ 94 5.1.3 product ecology statements................................................... 96 5.1.4 emc regulations .................................................................. 99 5.1.5 product certification markings (b oard level)............................ 100 5.2 battery disposal information........ .................................................... 101 figures 1. major board components.................................................................. 14 2. block diagram ................................................................................ 16 3. memory channel configuration an d dimm configuration........................ 21 4. dual channel (interleaved) mode configuration with two dimms............ 22 5. dual channel (interleaved) mode configuration with three dimms ......... 22 6. dual channel (interleaved) mode configuration with four dimms ........... 23 7. single channel (asymmetric) mode configuration with one dimm .......... 24 8. single channel (asymmetric) mode configuration with three dimms....... 24 9. flex mode configuration with two dimms............................................ 25 10. front/back panel audio connector options .......................................... 35 11. lan connector led locations ............................................................ 37 12. thermal sensors and fan headers ..................................................... 40 13. location of the onboard power indicator leds ..................................... 47 14. detailed system memory address map ............................................... 50 15. back panel connectors ..................................................................... 57 16. component-side connectors and headers ........................................... 58 17. connection diagram for front panel header ........................................ 64 18. connection diagram for front panel usb headers ................................ 66 19. connection diagram for ieee-1394a header ........................................ 66 20. location of the jumper block............................................................. 67 21. board dimensions ........................................................................... 68 22. i/o shield dimensions for boards with ieee-1394a and ps/2 connectors ............................................................................. 70 23. i/o shield dimensions for boards without ps/2 connectors ................... 71 24. i/o shield dimensions for boards without ieee-1394a and ps/2 connectors ............................................................................. 72 25. localized high temperature zones..................................................... 76
intel desktop board DQ965GF tec hnical product specification viii tables 1. feature summary............................................................................ 12 2. manufacturing options ..................................................................... 13 3. board components shown in figure 1 ................................................ 15 4. supported memory configurations ... .................................................. 18 5. memory operating frequencies ......................................................... 19 6. audio jack retasking support ........................................................... 34 7. lan connector led states ................................................................ 37 8. effects of pressing the power swit ch .................................................. 41 9. power states and targeted system power........................................... 42 10. wake-up devices and events ............................................................ 43 11. system memory map ....................................................................... 51 12. dma channels................................................................................. 51 13. i/o map ......................................................................................... 52 14. pci configuration space map .......... .................................................. 53 15. interrupts ...................................................................................... 54 16. pci interrupt routing map ................................................................ 55 17. component-side connectors and headers shown in figure 16................ 59 18. high definition audio link header ...................................................... 60 19. serial ata connectors ...................................................................... 60 20. chassis intrusion header .................................................................. 60 21. serial port header ........................................................................... 60 22. front and rear chassis fan headers .................................................. 60 23. processor fan header ...................................................................... 61 24. front panel audio header ................................................................. 61 25. processor core power connector...... .................................................. 63 26. main power connector...................................................................... 63 27. front panel header .......................................................................... 64 28. states for a one-color power led ...................................................... 65 29. states for a two-color power led...................................................... 65 30. auxiliary front panel power led header.............................................. 65 31. bios setup configuration jumper settings.......................................... 67 32. compatible i/o shields ..................................................................... 69 33. dc loading characteristics .......... ..................................................... 73 34. fan header current capability........................................................... 73 35. thermal considerations for compon ents ............................................. 77 36. desktop board DQ965GF environmental specifications.......................... 78 37. bios setup program menu bar.......................................................... 80 38. bios setup program function keys.................................................... 80 39. acceptable drives/media types for bios recovery ............................... 83 40. boot device menu options ................................................................ 84 41. supervisor and user password functions............................................. 86 42. beep codes .................................................................................... 87 43. bios error messages ....................................................................... 87 44. port 80h post code ranges.............................................................. 88 45. port 80h post codes ....................................................................... 89 46. typical port 80h post sequence........................................................ 92
contents ix 47. safety regulations........................................................................... 93 48. lead-free board markings ................................................................ 98 49. emc regulations ............................................................................. 99 50. product certification markings ...... .................................................... 100
intel desktop board DQ965GF tec hnical product specification x
11 1 product description what this chapter contains 1.1 overview........................................................................................ 12 1.2 online support................................................................................ 17 1.3 processor ....................................................................................... 17 1.4 system memory .............................................................................. 18 1.5 intel ? virtualization technology (intel ? vt)........................................ 26 1.6 intel ? vpro? technology support...................................................... 27 1.7 intel ? q965 express chipset............................................................. 28 1.8 legacy i/o controller ....................................................................... 33 1.9 audio subsystem............................................................................. 34 1.10 lan subsystem ............................................................................... 36 1.11 hardware management subsystem .................................................... 39 1.12 power management ......................................................................... 41 1.13 trusted platform module (tpm)..... ..................................................... 48
intel desktop board DQ965GF tec hnical product specification 12 1.1 overview 1.1.1 feature summary table 1 summarizes the major featur es of the desktop board DQ965GF. table 1. feature summary form factor microatx form factor (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) processor support for the following: ? intel ? core?2 duo processor in an lga775 socket with a 1066 or 800 mhz system bus ? intel ? pentium ? d processor in an lga775 socket with an 800 or 533 mhz system bus ? intel ? pentium ? 4 processor in an lga775 socket with an 800 or 533 mhz system bus ? intel ? celeron ? d processor in an lga775 socket with a 533 mhz system bus memory ? four 240-pin ddr2 sdram dual inline memory module (dimm) sockets ? support for ddr2 800, ddr2 667, or ddr2 533 mhz dimms ? support for up to 8 gb of syst em memory using ddr2 667 or ddr2 533 dimms ? support for up to 4 gb of system memory using ddr2 800 dimms chipset intel ? q965 express chipset, consisting of: ? intel ? 82q965 graphics memory controller hub (gmch) ? intel ? 82801ho i/o controller hub (ich8do) video intel ? gma 3000 onboard graphics subsystem audio 6-channel (5.1) audio subsystem using the sigmatel* stac9227 audio codec legacy i/o control legacy i/o controller for diskette drive, serial, parallel, and optional ps/2* ports usb support for usb 2.0 devices peripheral interfaces ? 10 usb ports ? one serial port ? one parallel port ? six serial ata interfaces ? one parallel ata ide interface with udma 33, ata-66/100/133 support ? one diskette drive interface lan support gigabit (10/100/1000 mbits/sec) lan subsystem using the intel ? 82566dm gigabit ethernet controller bios ? intel ? bios (resident in the spi flash device) ? support for advanced configuration and power interface (acpi), plug and play, and smbios trusted platform module (tpm), revision 1.2 a component that enhances platform security continued
product description 13 table 1. feature summary (continued) instantly available pc technology ? support for pci local bus specification revision 2.3 ? support for pci express* revision 1.0a ? suspend to ram support ? wake on pci, rs-232, front panel, ps/2 devices, and usb ports expansion capabilities ? two pci conventional* bus connectors ? one pci express x1 bus add-in card connector ? one pci express x16 bus add-in card connector hardware monitor subsystem ? intel ? quiet system technology implemented through the ich8 manageability engine ? voltage sense to detect out of range power supply voltages ? thermal sense to detect out of range thermal values ? three fan headers ? three fan sense inputs used to monitor fan activity intel ? vpro ? technology support provides remote management, improv ed security, and energy-efficient performance 1.1.2 manufacturing options table 2 describes the manufacturing options. not every manufacturing option is available in all marketing channels. please contact your intel representative to determine which manufacturing options are available to you. table 2. manufacturing options ieee-1394a interfaces two ieee-1394a interfaces: one back pane l connector and one front-panel header ps/2 ports back panel ps/2 ports for mouse and keyboard connection for information about refer to available configurations for the desktop board DQ965GF section 1.2, page 17
intel desktop board DQ965GF tec hnical product specification 14 1.1.3 board layout figure 1 shows the location of the major components. x w v u t s q r p o n l m j k i g h f e d c b a y z aa bb cc dd om18440 figure 1. major board components table 3 lists the compon ents identified in figure 1.
product description 15 table 3. board components shown in figure 1 item/callout from figure 1 description a ieee-1394a front panel header (optional) b front panel audio header c pci conventional bus add-in card connector 1 d pci express x1 connector e pci express x16 connector f back panel connectors g processor core power connector h rear chassis fan header i lga775 processor socket j intel 82q965 gmch k processor fan header l dimm channel a sockets m serial port header n dimm channel b sockets o diskette drive connector p main power connector q battery r front chassis fan header s chassis intrusion header t intel 82801ho i/o controller hub (ich8do) u bios setup configuration jumper block v auxiliary front panel power led header w front panel header x serial ata connectors [6] y front panel usb header z speaker aa front panel usb header bb parallel ate ide connector cc pci conventional bus add-in card connector 2 dd high definition audio header
intel desktop board DQ965GF tec hnical product specification 16 1.1.4 block diagram figure 2 is a block diagram of the major functional areas. intel q965 express chipset intel 82801ho i/o controller hub (ich8do) intel 82q965 graphics and memory controller hub (gmch) serial peripheral interface (spi) flash device system bus (1066/800/533 mhz) lga775 processor socket parallel ata ide connector diskette drive connector legacy i/o controller ps/2 keyboard* ps/2 mouse* parallel port om18449 audio codec pci express x16 connector pci bus smbus high definition audio link usb dual-channel memory bus smbus pci slot 1 pci slot 2 serial ata ide connectors (6) serial ata ide interface channel a dimms (2) channel b dimms (2) back panel/front panel usb ports dmi interconnect pci express x1 slot 1 pci express x1 interface lan connector gigabit ethernet controller line out/retasking jack line out line in/retasking jack mic in/retasking jack mic in pci bus ieee-1394a connector/header* ieee-1394a controller* serial port parallel ata ide controller high definition audio link header pci express x16 interface vga port display interface lpc bus * = optional tpm component lpc bus figure 2. block diagram
product description 17 1.2 online support to find information about? visit this world wide web site: intel ? desktop board DQ965GF under ?desktop board products? or ?desktop board support? http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop available configurations for the desktop board DQ965GF http://developer.intel.com/desig n/motherbd/gf/gf_available.htm processor data sheets http://www.intel.com/products/index.htm ich8do addressing http://developer.intel.com/d esign/chipsets/datashts audio software and utilities http://www.intel.com/design/motherbd lan software and drivers http://www.intel.com/design/motherbd supported video modes http://www.intel.com/design/mothe rbd/gf/gf_documentation.htm 1.3 processor the board is designed to suppo rt the following processors: ? intel core 2 duo processor in an lga775 socket with a 1066 or 800 mhz system bus ? intel pentium d processor in an lga775 processo r socket with an 800 or 533 mhz system bus ? intel pentium 4 processor in an lga775 processo r socket with an 800 or 533 mhz system bus ? intel celeron d processor in an lg a775 processor socket with a 533 mhz system bus see the intel web site listed below for the most up-to-date list of supported processors. for information about? refer to: supported processors http://www.intel.com/design /motherbd/gf/gf_proc.htm caution use only the processors listed on web site above. use of unsupported processors can damage the board, the processor, and the power supply. # integrator?s note use only atx12v-compliant power supplies. for information about refer to power supply connectors section 2.7.2.2, page 63
intel desktop board DQ965GF tec hnical product specification 18 1.4 system memory the board has four dimm sockets and su pports the following memory features: ? 1.8 v (only) ddr2 sdram dimms with gold-plated contacts ? unbuffered, single-sided or double-sided dimms with the following restriction: double-sided dimms with x16 organization are not supported. ? 8 gb maximum total system memory using ddr2 667 or ddr2 533 dimms; 4 gb maximum total system memory using ddr2 800 dimms. refer to section 2.1.1 on page 49 for information on the total amount of addressable memory. ? minimum total system memory: 512 mb ? non-ecc dimms ? serial presence detect ? ddr2 800, ddr2 667, or ddr2 533 mhz sdram dimms ? ddr2 800 dimms with spd timings of on ly 5-5-5 or 6-6-6 (tcl-trcd-trp) note a minimum of 512 mb of system memory is re quired to fully enable both the onboard graphics and the manageability engine. note to be fully compliant with all applicable ddr sdram memory specifications, the board should be populated with dimms that support the serial presence detect (spd) data structure. this enables the bios to read the spd data and program the chipset to accurately configure memory settings for op timum performance. if non-spd memory is installed, the bios will attempt to co rrectly configure the memory settings, but performance and reliability may be impacted or the dimms may not function under the determined frequency. table 4 lists the supported dimm configurations. table 4. supported memory configurations dimm type sdram technology smallest usable dimm (one x16 single-sided dimm) largest usable dimm (one x8 double-sided dimm) maximum capacity with four identical x8 double-sided dimms ddr2 533 256 mbit 128 mb 512 mb 2 gb ddr2 533 512 mbit 256 mb 1 gb 4 gb ddr2 533 1 gbit 512 mb 2 gb 8 gb ddr2 667 256 mbit 128 mb 512 mb 2 gb ddr2 667 512 mbit 256 mb 1 gb 4 gb ddr2 667 1 gbit 512 mb 2 gb 8 gb ddr2 800 256 mbit 128 mb 512 mb 2 gb ddr2 800 512 mbit 256 mb 1 gb 4 gb
product description 19 note regardless of the dimm type used, the memory frequency will either be equal to or less than the processor system bus frequenc y. for example, if ddr2 800 memory is used with a 533 mhz system bus frequency processor, the memory will operate at 533 mhz. table 5 lists the resulting operatin g memory frequencies based on the combination of dimms and processors. table 5. memory operating frequencies dimm type processor system bus freq uency resulting memory frequency ddr2 533 533 mh z 533 mhz ddr2 533 800 mh z 533 mhz ddr2 533 1066 mhz 533 mhz ddr2 667 533 mh z 533 mhz ddr2 667 800 mh z 667 mhz ddr2 667 1066 mhz 667 mhz ddr2 800 533 mh z 533 mhz ddr2 800 800 mh z 800 mhz ddr2 800 1066 mhz 800 mhz
intel desktop board DQ965GF tec hnical product specification 20 1.4.1 memory configurations the intel 82q965 gmch supports the followi ng types of memory organization: ? dual channel (interleaved) mode . this mode offers the highest throughput for real world applications. dual channel mode is enabled when the installed memory capacities of both dimm channels are equal. technology and de vice width can vary from one channel to the other but the inst alled memory capacity for each channel must be equal. if different speed dimms are used between channels, the slowest memory timing will be used. ? single channel (asymmetric) mode . this mode is equivalent to single channel bandwidth operation for real world applications. this mode is used when only a single dimm is installed or the memory capacities are unequal. technology and device width can vary from one channel to the other. if different speed dimms are used between channels, the slowest memory timing will be used. ? flex mode . this mode provides the most flex ible performance characteristics. the bottommost dram memory (the memory that is lowest within the system memory map) is mapped to dual channe l operation; the topmost dram memory (the memory that is nearest to the 8 gb address space limit), if any, is mapped to single channel operation. flex mode results in multiple zones of dual and single channel operation across the whole of dram memory. to use flex mode, it is necessary to popula te both channels. figure 3 illustrates the memory channel and dimm configuration. note the dimm0 sockets of both channels are bl ue. the dimm1 sockets of both channels are black.
product description 21 figure 3. memory channel conf iguration and dimm configuration # integrator?s note regardless of the memory configuration used (dual channel, single channel, or flex mode), dimm 0 of channel a must always be populated. this is a requirement of the ich8 manageability engine feature.
intel desktop board DQ965GF tec hnical product specification 22 1.4.1.1 dual channel (interleaved) mode configurations figure 4 shows a dual channel configuratio n using two dimms. in this example, the dimm0 (blue) sockets of both channels are populated with identical dimms. om18339 channel a, dimm 0 channel a, dimm 1 channel b, dimm 0 channel b, dimm 1 1 gb 1 gb figure 4. dual channel (interleaved) mode configuration with two dimms figure 5 shows a dual channel configuration using three dimms. in this example, the combined capacity of the two dimms in ch annel a equal the capacity of the single dimm in the dimm0 (blue) socket of channel b. om18340 channel a, dimm 0 channel a, dimm 1 channel b, dimm 0 channel b, dimm 1 1 gb 1 gb 512 mb 512 mb figure 5. dual channel (interleaved) mode configuration with three dimms
product description 23 figure 6 shows a dual channel configuration using four dimms. in this example, the combined capacity of the two dimms in cha nnel a equal the combined capacity of the two dimms in channel b. also, the di mms are matched between dimm0 and dimm1 of both channels. om18341 channel a, dimm 0 channel a, dimm 1 channel b, dimm 0 channel b, dimm 1 1 gb 1 gb 512 mb 1 gb 512 mb figure 6. dual channel (interleaved) mode configuration with four dimms
intel desktop board DQ965GF tec hnical product specification 24 1.4.1.2 single channel (asymmetric) mode configurations note dual channel (interleaved) mode config urations provide the highest memory throughput. figure 7 shows a single channel configuration using one dimm. in this example, only the dimm0 (blue) socket of channel a is populated. channel b is not populated. om18344 channel a, dimm 0 channel a, dimm 1 channel b, dimm 0 channel b, dimm 1 1 gb figure 7. single channel (asymmetric) mode configuration with one dimm figure 8 shows a single channel configuration using three dimms. in this example, the combined capacity of the two dimms in cha nnel a does not equal the capacity of the single dimm in the dimm0 (blue) socket of channel b. om18343 channel a, dimm 0 channel a, dimm 1 channel b, dimm 0 channel b, dimm 1 1 gb 1 gb 512 mb 1 gb figure 8. single channel (asymmetric) mode configuration with three dimms
product description 25 1.4.1.3 flex mode configuration note the use of flex mode requires dimms to be installed in both channels. figure 9 shows a flex mode configuration using two dimms. the operation is as follows: ? the 512 mb dimm in the channel a, dimm 0 socket and the lower 512 mb of the dimm in the channel b, dimm 0 socket oper ate together in dual channel mode. ? the remaining (upper) 512 mb of the di mm in channel b operates in single channel mode. om18404 channel a, dimm 0 channel a, dimm 1 channel b, dimm 0 channel b, dimm 1 1 gb 512 mb figure 9. flex mode configuration with two dimms
intel desktop board DQ965GF tec hnical product specification 26 1.5 intel ? virtualization technology (intel ? vt) virtualization is a proven technology that enables one computer to function as multiple ?virtual? systems. it enables multiple operating systems and application stacks to be hosted in logically isolated partitions ? also known as virtual machines. partitions are independent virtualized enviro nments within the same pc with shared, prioritized access to system hardware. platform resources, such as processors, memory, storage, and network adapters can be a llocated and prioritize d for the different partitions to meet specific business and application requirements. intel ? virtualization technology (intel ? vt) offers silicon-level support for core virtualization processes and a new, dedicated space in the software stack for an intel ? lightweight virtual machine monitor (intel ? lvmm) ? a software layer that controls and prioritizes each partition?s access to the system hardware. intel provides the virtualization capability within intel virtualization technology- enabled processors and validated chipsets. an intel virtualization technology-enabled bios is also needed. standard memory, storage, and graphics cards work with the intel virtualization technology solution. however, because the quality and amount of such system resources directly affect virtualization performance, it is advisable to be generous in these areas. using an intel ? network adapter and compatible driver ensures the ability to take advantage of the advanced security and manageability capabilities of intel virtualization technology. a virtual machine monitor enabled for intel virtualization technology, such as intel ? lvmm, is also required. intel lvmm is available to independent software vendors (isvs). after the system hardware and vmm are in place, intel virtualization technology-enabled applications will need to be installed to take advantage of the built-in hardware capabilities of intel virtualization technology and the virtualization enhancement of intel lvmm. for information about refer to intel virtualization technology http://www.intel.com/go /dovirtualization/ # integrator?s note intel virtualization technology-based platforms require system hardware, virtualization software, and applications that are enabled for intel virtualization technology. individual pc manufacturers will determine wh ether to ship their platforms with intel virtualization technology enabled or disabled by default. also, each pc manufacturer may choose to ship intel lvmm already insta lled on their platforms or on separate cd-roms.
product description 27 1.6 intel ? vpro ? technology support the board supports intel vpro technology, in tel?s platform for the digital office. intel vpro technology with active ma nagement technology provides remote management, improved security, an d energy-efficient performance. the management engine microcontroller in the intel q965 express chipset provides remote hardware management capabilities regardless of the state of the operating system. the embedded packet filters an d sensors in ich8do provide enhanced security features customizable through third party applications. # integrator?s note in addition to the hardware support on the board (the intel 82801ho ich8do and the intel 82566dm gigabit ethernet controller), inte l vpro technology requires the use of an intel core 2 duo processor and co mpatible third-party applications. for information about refer to intel vpro technology and compatible third- party applications http://www.intel.com/vpro/
intel desktop board DQ965GF tec hnical product specification 28 1.7 intel ? q965 express chipset the intel q965 express chipset cons ists of the following devices: ? intel 82q965 graphics and memory contro ller hub (gmch) wi th direct media interface (dmi) interconnect ? intel 82801ho i/o controller hub (ich 8do) with dmi interconnect the gmch component provides interfaces to the cpu, memory, pci express, and the dmi interconnect. the component also provides integrated graphics capabilities supporting 3d, 2d and display capabilities. the ich8do is a centralized controller for the board?s i/o paths. for information about refer to the intel q965 express chipset http://developer.intel.com/ resources used by the chipset chapter 2 1.7.1 intel q965 graphics subsystem the intel q965 express chipset contains tw o separate, mutually exclusive graphics options. either the gma 3000 graphics controller (contained within the 82q965 gmch) is used, or a pci express x16 add-in card can be used. when a pci express x16 add-in card is installed, the gm a 3000 graphics controller is disabled. 1.7.1.1 intel ? gma 3000 graphics controller the intel gma 3000 graphics controller features the following: ? 667 mhz core frequency ? high performance 3-d se tup and render engine ? high quality texture engine ? dx9.0c* and opengl* 1.4 + extensions compliant ? vertex shader model 2.0 / 3.0 (software only) ? hardware pixel shader 2.0 ? 32-bit and 16-bit full precision floating point operations ? up to eight multiple render targets (mrts) ? occlusion query ? 128-bit floating poin t texture formats ? bilinear, trilinear, and anisotropic mipmap filtering ? shadow maps and double sided stencils ? alpha and luminance maps ? texture color-keying/chroma-keying ? cubic environment re flection mapping ? enhanced texture blending functions ? 3d graphics rendering enhancements ? 1.3 dual texture gigapixel/sec fill rate ? 16 and 32 bit color
product description 29 ? maximum 3d supported resoluti on of 1600 x 1200 x 32 at 85 hz ? vertex cache ? anti-aliased lines ? opengl version 1.5 support with vert ex buffer and ext_shadow extensions ? 2d graphics enhancements ? 8, 16, and 32 bit color ? optimized 256-bit blt engine ? color space conversion ? anti-aliased lines ? video ? hardware motion compensati on for mpeg2 and hd video ? software dvd at 30 fps full screen ? motion adaptive de-interlacing ? display ? integrated 24-bit 400 mhz ramdac ? up to 2048 x 1536 at 75 hz refresh (qxga) ? dvi specification 1.0 compliant ? dual independent display opti ons with digital display ? 180-degree hardware screen rotation ? hardware color cursor support ? supports tmds transmitters or tv-out encoders ? hdcp support ? ddc2b compliant interface with advanced digital display 2 card or media expansion card (add2/mec), support for tv-out/tv-in and dvi digital display connections ? supports flat panels up to 2048 x 1536 at 75 hz (when in dual-channel mode) or digital crt/hdtv at 1920 x 1080 at 85 hz (with add2/mec) ? two multiplexed sdvo port interfaces with 270 mhz pixel clocks using an add2/mec card ? dynamic video memory technology (dvmt) support up to 256 mb ? intel ? zoom utility 1.7.1.2 dynamic video memory technology (dvmt) dvmt enables enhanced graphics and memory performance through highly efficient memory utilization. dvmt ensures the most efficient use of available system memory for maximum 2-d/3-d graphics performance. up to 256 mb of system memory can be allocated to dvmt on systems that have 512 mb or more of total system memory installed. dvmt returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem. dvmt will always use a minimal fixed portion of system physical memory (as set in the bios setup program) for compatibility with legacy applications. an example of this would be when using vga graphics under do s. once loaded, the operating system
intel desktop board DQ965GF tec hnical product specification 30 and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions. note the use of dvmt requires oper ating system driver support. 1.7.1.3 configuration modes a list of supported modes for the intel gm a 3000 graphics controller is available as a downloadable document. for information about refer to supported video modes for the board section 1.2, page 17 1.7.1.4 advanced digital display (add2/mec) card support the gmch routes two multiplexed sdvo ports that are each capable of driving up to a 200 mhz pixel clock to the pci express x16 co nnector. the sdvo ports can be paired for a dual channel configuration to support up to a 400 mhz pixel clock. when an add2/mec card is detected, the intel gma 3000 graphics controller is enabled and the pci express x16 connector is configured for sdvo mode. sdvo mode enables the sdvo ports to be accessed by the add2/mec card. an add2/mec card can either be configured to support simultaneous displa y with the primary vga display or can be configured to support dual independent display as an ex tended desktop configuration with different color depths and resolutions. add2/mec cards can be designed to support the following configurations: ? tv-out (composite video) ? transition minimized differential signaling (tmds) for dvi 1.0 ? low voltage differential signaling (lvds) ? single device operating in dual channel mode ? vga output ? hdtv output ? hdmi/udi support (when used with the hd audio link) 1.7.2 usb the board supports up to 10 usb 2.0 ports, supports uhci and ehci, and uses uhci- and ehci-compatible drivers. the ich8do provides the usb controller for all ports. the port arrangement is as follows: ? six ports are implemented with stacked back panel connectors ? four ports are routed to two se parate front panel usb headers
product description 31 note computer systems that have an unshielde d cable attached to a usb port may not meet fcc class b requirements, even if no device is attached to the cable. use shielded cable that meets the requ irements for full-speed devices. for information about refer to the location of the usb connectors on the back panel figure 15, page 57 the location of the front panel usb headers figure 16, page 58 1.7.3 serial ata interfaces the board provides six serial ata (sata) connectors, which support one device per connector. 1.7.3.1 serial ata support the ich8do?s serial ata controller offers six independent serial ata ports with a theoretical maximum transfer rate of 3 gbits/ sec per port. one device can be installed on each port for a maximum of six serial ata devices. a point-to-point interface is used for host to device connections, unlike parallel ata ide which supports a master/slave configuration an d two devices per channel. for compatibility, the underlying serial ata functionality is transparent to the operating system. the serial ata controlle r can operate in both legacy and native modes. in legacy mode, standard ide i/ o and irq resources are assigned (irq 14 and 15). in native mode, standard pci conv entional bus resource steering is used. native mode is the preferred mode for co nfigurations using the windows* xp and windows 2000 operating systems. note many serial ata drives use new low-voltag e power connectors and require adaptors or power supplies equipped with lo w-voltage power connectors. for more information, see: http://www.serialata.org/ for information about refer to the location of the serial ata connectors figure 16, page 58 1.7.3.2 serial ata raid the ich8do supports the following raid (redundant array of independent drives) levels: ? raid 0 - data striping ? raid 1 - data mirroring ? raid 0+1 (or raid 10) - data striping and mirroring ? raid 5 - distributed parity
intel desktop board DQ965GF tec hnical product specification 32 1.7.4 parallel ide interface the parallel ata ide controller has one bus-mastering parallel ata ide interface. the parallel ata ide interface supports the following modes: ? programmed i/o (pio): processor controls data transfer. ? 8237-style dma: dma offloads the processo r, supporting transfer rates of up to 16 mb/sec. ? ultra dma: dma protocol on ide bus su pporting host and target throttling and transfer rates of up to 33 mb/sec. ? ata-66: dma protocol on ide bus suppo rting host and target throttling and transfer rates of up to 66 mb/sec. ata-66 protocol is similar to ultra dma and is device driver compatible. ? ata-100: dma protocol on ide bus allows host and target throttling. the ata-100 logic can achieve read transfer rates up to 100 mb/sec and write transfer rates up to 88 mb/sec. ? ata-133: dma protocol on ide bus allows host and target throttling. the ata-133 logic is designed to achieve read transfer rates up to 133 mb/sec and write transfer rates in excess of 100 mb/sec. note ata-66, ata-100, and ata-133 are faster timi ngs and require a specialized cable to reduce reflections, noise, and inductive coupling. the parallel ata ide interface also support s atapi devices (such as cd-rom drives) and ata devices. the bios supports logi cal block addressing (lba) and extended cylinder head sector (echs) translation mode s. the drive reports the transfer rate and translation mode to the bios. for information about refer to the location of the parallel ata ide connector figure 16, page 58 1.7.5 real-time clock, cmos sram, and battery a coin-cell battery (cr2032) powers the re al-time clock and cmos memory. when the computer is not plugged into a wall so cket, the battery has an estimated life of three years. when the computer is plu gged in, the standby current from the power supply extends the life of the battery. the clock is accurate to 13 minutes/year at 25 oc with 3.3 vsb applied. note if the battery and ac power fail, custom defa ults, if previously saved, will be loaded into cmos ram at power-on. when the voltage drops below a certain leve l, the bios setup program settings stored in cmos ram (for example, the date and time) might not be accurate. replace the battery with an equivalent one. figure 1 on page 14 shows the location of the battery.
product description 33 1.8 legacy i/o controller the i/o controller provides the following features: ? one serial port ? one parallel port with extended capabilities port (ecp) and enhanced parallel port (epp) support ? serial irq interface compatible with serialized irq support for pci systems ? ps/2-style mouse and keyboard interfaces ? interface for one 1.44 mb or 2.88 mb diskette drive ? intelligent power management, including a programmable wake-up event interface ? pci power management support the bios setup program provides configuration options for the i/o controller. 1.8.1 serial port interface the serial port header is located on the comp onent side of the boar d. the serial port supports data transfers at speeds up to 115.2 kbits/sec with bios support. for information about refer to the location of the serial port header figure 16, page 58 1.8.2 parallel port interface the parallel port connector is located on th e back panel. use the bios setup program to set the parallel port mode. for information about refer to the location of the parallel port connector figure 15, page 57 1.8.3 diskette drive interface the i/o controller supports one diskette dr ive. use the bios setup program to configure the diskette drive interface. for information about refer to the location of the di skette drive connector figure 16, page 58 1.8.4 ps/2 keyboard and mouse interface (optional) the optional ps/2 keyboard and mouse co nnectors are located on the back panel. note the keyboard is supported in the bottom ps/2 connector and the mouse is supported in the top ps/2 connector. power to the computer should be turned off before a keyboard or mouse is connected or disconnected. for information about refer to the location of the optional keyboard and mouse connectors figure 15, page 57
intel desktop board DQ965GF tec hnical product specification 34 1.9 audio subsystem the onboard audio subsystem consists of the following: ? intel 82801ho ich8do ? sigmatel stac9227 audio codec ? back panel audio connectors ? component-side audio headers: ? front panel audio header ? hd audio link header ? advanced jack sense for the front/back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. within hardware constraints, the back panel audio jacks are capable of retasking according to the user?s definition, or can be automatically switched depending on the recognized device type. ? a signal-to-noise (s/n) ratio of 95 db table 6 lists the supported retasking function s of the front panel and back panel audio jacks. table 6. audio jack retasking support audio jack supports line in? supports line out? supports microphone? supports headphones? front panel ? green yes yes no yes front panel ? pink yes no yes no back panel ? blue yes yes no no back panel ? green no yes no yes back panel ? pink yes yes yes no 1.9.1 audio subsystem software audio software and drivers are availabl e from intel?s worl d wide web site. for information about refer to obtaining audio software and drivers section 1.2, page 17
product description 35 1.9.2 audio connectors and headers the board contains audio connectors and he aders on both the back panel and the component side of the board. the front pa nel audio header provides mic in and line out signals for the front panel. microphone bias is supported for both the front and back panel microphone connectors. the front/back panel audio connectors are configurable through the audio device drivers. the available configurable audio ports are shown in figure 10. om18469 line in/retasking jack [blue] mic in/retasking jack [pink] line out/retasking jack [green] mic in/ retasking jack [pink] line out/ retasking jac k [green] front panel audio connectors [routed from front panel audio header] back panel audio connectors figure 10. front/back panel audio connector options for information about refer to the location of the front panel audio header figure 16, page 58 the signal names of the front panel audio header table 24, page 61 the location of the hd audio link header figure 16, page 58 the signal names of th e hd audio link header table 18, page 60 the back panel audio connectors section 2.7.1, page 57
intel desktop board DQ965GF tec hnical product specification 36 1.10 lan subsystem the lan subsystem consists of the following: ? intel 82566dm gigabit (10/100/1000 mbits/ sec) ethernet lan controller ? intel 82801ho ich8do ? rj-45 lan connector with integrated status leds additional features of the lan subsystem include: ? csma/cd protocol engine ? lan connect interface between ich8do and lan controller ? pci conventional bu s power management ? supports acpi technology ? supports lan wake capabilities ? lan subsystem software lan software and drivers are availabl e from intel?s worl d wide web site. 1.10.1 intel ? 82566dm gigabit ethernet controller the intel 82566dm gigabit ethernet contro ller supports the following features: ? pci express link ? 10/100/1000 ieee 802.3 compliant ? compliant to ieee 802.3x flow control support ? jumbo frame support ? tcp, ip, udp checksum offload ? transmit tcp segmentation ? advanced packet filtering ? full device driver compatibility ? pci express power management support the intel 82566dm also provides support for: ? alert standard format (asf) 2.0 ? intel ? active management technology (intel ? amt) ? virtual lan driver support for intel vt partitions 1.10.2 lan subsystem software lan software and drivers are availabl e from intel?s worl d wide web site. for information about refer to obtaining lan software and drivers section 1.2, page 17
product description 37 1.10.3 rj-45 lan connector with integrated leds two leds are built into the rj-45 lan connector (shown in figure 11 below). link led (green) data rate led (green/yellow) om18329 figure 11. lan connector led locations table 7 describes the led states when the board is powered up and the lan subsystem is operating. table 7. lan connector led states led led color led state condition off lan link is not established. on lan link is established. link green blinking lan activity is occurring. off 10 mbits/sec data rate is selected. green 100 mbits/sec data rate is selected. data rate green/yellow yellow 1000 mbits/sec data rate is selected. 1.10.4 intel ? active management technology (intel ? amt) with system defense feature intel active management tec hnology offers it organizations tamper-resistant and persistent management capabilities. spec ifically, intel amt is a hardware-based solution that uses out of band communica tion to manage access client systems in addition to offering encr ypted and persistent asse t management and remote diagnostics and/or recovery capabilities for networked platforms. with intel amt, it organizations can easily get accurate platform informatio n, and can perform remote updating, diagnostics, debugging and repair of a system , regardless of the state of the operating system and the powe r state of the system. note software with amt capability is required to take advantage of intel amt platform management capabilities. the key features of intel amt include: ? secure out of band (oob) system manage ment that allows remote management of pcs regardless of system powe r or operating system state. ? remote troubleshooting and recovery that can significantly redu ce desk-side visits and potentially increasing effici ency of it technical staff. ? proactive alerting that decreases down time and minimizes time to repair.
intel desktop board DQ965GF tec hnical product specification 38 ? third party non-volatile storage that prevents users from removing critical inventory, remote control, or virus protection agents. ? remote hardware and softwa re asset tracking that eliminates time-consuming manual inventory tracking, which also reduces asset accounting costs. ? system defense feature - an intel amt fe ature for stopping the propagation of worms and viruses through the use of programmable packet filters in the integrated lan controller. the packet filters inspect all incoming and all outgoing packets and determine whether to block or pass the packets as configured. there is no indication to the host that a packet has been blocked or accepted. for information about refer to intel active management technology http://www.intel.com/technolo gy/manage/iamt/index.htm 1.10.5 alert standard format (asf) 2.0 support the board provides the following asf support for pci express x1 bus add-in lan cards and pci conventional bus add-in lan cards: ? monitoring of system firmware progress events, including: ? bios present ? primary processor initialization ? memory initialization ? video initialization ? pci resource configuration ? hard-disk initialization ? user authentication ? starting operating system boot process ? monitoring of system firmwa re error events, including: ? memory missing ? memory failure ? no video device ? keyboard failure ? hard-disk failure ? no boot media ? boot options to boot from di fferent types of boot devices ? reset, shutdown, power cycl e, and power up options ? lan subsystem software lan software and drivers are availabl e from intel?s worl d wide web site.
product description 39 1.11 hardware management subsystem the hardware management features enable th e board to be compatible with the wired for management (wfm) specification. th e board has several hardware management features, including the following: ? fan monitoring and control ? thermal and voltage monitoring ? chassis intrusion detection 1.11.1 hardware monitoring and fan control the features of the hardware monitoring and fan control include: ? intel quiet system technology, delivering acoustically-optimized thermal management ? fan speed control controllers and se nsors integrated into the ich8do ? four thermal sensors (processor, 82q 965 gmch, 82801ho ich8do, and a remote thermal sensor) ? power supply monitoring of five voltages (+5 v, +12 v, +3.3 vsb, +1.25 v, and +vccp) to detect levels above or below acceptable values ? thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed 1.11.2 fan monitoring fan monitoring can be implemented using intel desktop utilities or third-party software. for information about refer to the functions of the fan headers section 1.12.2.2, page 44 1.11.3 chassis intrusion and detection the board supports a chassis security featur e that detects if the chassis cover is removed. the security feature uses a mechan ical switch on the chassis that attaches to the chassis intrusion header. when the chassis cover is removed, the mechanical switch is in the closed position. for information about refer to the location of the chassis intrusion header figure 16, page 58
intel desktop board DQ965GF tec hnical product specification 40 1.11.4 thermal monitoring figure 12 shows the locations of th e thermal sensors and fan headers. c f b e a g om18441 d item description a thermal diode, located on processor die b thermal diode, located on the gmch die c thermal diode, located on the ich8do die d remote thermal sensor e processor fan f front chassis fan g rear chassis fan figure 12. thermal sensors and fan headers
product description 41 1.12 power management power management is implemented at several levels, including: ? software support through advanced conf iguration and power interface (acpi) ? hardware support: ? power connector ? fan headers ? lan wake capabilities ? instantly available pc technology ? resume on ring ? wake from usb ? wake from ps/2 devices ? power management event sign al (pme#) wake-up support 1.12.1 acpi acpi gives the operating system direct co ntrol over the power management and plug and play functions of a computer. the us e of acpi with the board requires an operating system that provides full acpi support. acpi features include: ? plug and play (including bus and device enumeration) ? power management control of individual devices, add-in boards (some add-in boards may require an acpi-aware driver), video displays, and hard disk drives ? methods for achieving less than 15-watt syst em operation in the power-on/standby sleeping state ? a soft-off feature that enables the operat ing system to power-off the computer ? support for multiple wake-up events (see table 10 on page 43) ? support for a front panel power and sleep mode switch table 8 lists the system states based on how long the power switch is pressed, depending on how acpi is configured with an acpi-aware operating system. table 8. effects of pressing the power switch if the system is in this state? ?and the power switch is pressed for ?the system enters this state off (acpi g2/g5 ? soft off) less than four seconds power-on (acpi g0 ? working state) on (acpi g0 ? working state) less than four seconds soft-off/standby (acpi g1 ? sleeping state) on (acpi g0 ? working state) more than four seconds fail safe power-off (acpi g2/g5 ? soft off) sleep (acpi g1 ? sleeping state) less than four seconds wake-up (acpi g0 ? working state) sleep (acpi g1 ? sleeping state) more than four seconds power-off (acpi g2/g5 ? soft off)
intel desktop board DQ965GF tec hnical product specification 42 1.12.1.1 system states and power states under acpi, the operating system direct s all system and device power state transitions. the operating system puts de vices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. devices that are not being used can be tu rned off. the operating system uses information from applications and user setti ngs to put the system as a whole into a low-power state. table 9 lists the power states supported by the board along with the associated system power targets. see the acpi specif ication for a complete description of the various system and power states. table 9. power states and targeted system power global states sleeping states processor states device states targeted system power (note 1) g0 ? working state s0 ? working c0 ? working d0 ? working state. full power > 30 w g1 ? sleeping state n/a c1 ? stop grant d1, d2, d3 ? device specification specific. 5 w < power < 52.5 w g1 ? sleeping state s3 ? suspend to ram. context saved to ram. no power d3 ? no power except for wake-up logic. power < 5 w (note 2) g1 ? sleeping state s4 ? suspend to disk. context saved to disk. no power d3 ? no power except for wake-up logic. power < 5 w (note 2) g2/s5 s5 ? soft off. context not saved. cold boot is required. no power d3 ? no power except for wake-up logic. power < 5 w (note 2) g3 ? mechanical off. ac power is disconnected from the computer. no power to the system. no power d3 ? no power for wake-up logic, except when provided by battery or external source. no power to the system. service can be performed safely. notes: 1. total system power is dependent on the system co nfiguration, including add-in boards and peripherals powered by the system chassis? power supply. 2. dependent on the standby power consumptio n of wake-up devices used in the system.
product description 43 1.12.1.2 two-watt standby in 2001, the u.s. government issued an executive order requir ing a reduction in power for appliances and personal computers. this board meets that requirement by operating at 1.5 w (or less) in s5 (standby) mode. two-watt operation applies only to the s5 state when the computer is turned off, but still connected to ac power. two-watt operation does not apply to the s3 (suspend to ram) or s4 (suspend to disk) states. newer energy-efficient power supplies usin g less than 0.5 w (in standby mode) may also be needed to achieve this goal. 1.12.1.3 wake-up devices and events table 10 lists the devices or specific events that can wake the computer from specific states. table 10. wake-up devices and events these devices/events can wake up the computer? ?from this state lan s3, s4, s5 (note) pme# signal s3, s4, s5 (note) power switch s3, s4, s5 ps/2 devices s3 rtc alarm s3, s4, s5 serial port s3 usb s3 wake# signal s3, s4, s5 note: for lan and pme# signal, s5 is disabled by default in the bios setu p program. setting this option to power on will enable a wake-up event from lan in the s5 state. note the use of these wake-up events from an acpi state requires an operating system that provides full acpi support. in additi on, software, drivers, and peripherals must fully support acpi wake events. 1.12.2 hardware support caution ensure that the power supply provides adeq uate +5 v standby current if lan wake capabilities and instantly available pc technolo gy features are used. failure to do so can damage the power supply. the total am ount of standby current required depends on the wake devices supported and manufacturing options. the board provides several power manage ment hardware features, including: ? power connector ? fan headers
intel desktop board DQ965GF tec hnical product specification 44 ? lan wake capabilities ? instantly available pc technology ? resume on ring ? wake from usb ? wake from ps/2 keyboard ? pme# signal wake-up support ? wake# signal wake-up support lan wake capabilities and instantly available pc technology require power from the +5 v standby line. resume on ring enables tele phony devices to access the computer when it is in a power-managed state. the method used de pends on the type of telephony device (external or internal). note the use of resume on ring and wake from usb technologies from an acpi state requires an operating system th at provides full acpi support. 1.12.2.1 power connector atx12v-compliant power supplies can turn off the system power through system control. when an acpi-enabled system receives the correct command, the power supply removes all non-standby voltages. when resuming from an ac power failure, th e computer returns to the power state it was in before power was interrupted (on or off). the computer?s response can be set using the last power state feature in th e bios setup program?s boot menu. for information about refer to the location of the main power connector figure 16, page 58 the signal names of the main power connector table 26, page 63 1.12.2.2 fan headers the function/operation of the fan headers is as follows: ? the fans are on when the board is in the s0 state. ? the fans are off when the board is off or in the s3, s4, or s5 state. ? each fan header is wired to a fan tachomet er input of the hardware monitoring and fan control device. ? all fan headers support closed-loop fan co ntrol that can adjust the fan speed or switch the fan on or off as needed. ? all fan headers have a +12 v dc connection. for information about refer to the locations of the fan headers and thermal sensors figure 12, page 40 the signal names of the processor fan header table 23, page 61 the signal names of the chassis fan headers table 22, page 60
product description 45 1.12.2.3 lan wake capabilities caution for lan wake capabilities, the +5 v stan dby line from the power supply must be capable of providing adequate +5 v standby current. failure to provide adequate standby current when implementing lan wake capabilities ca n damage the power supply. lan wake capabilities enable remote wake-up of the computer through a network. the lan subsystem pci bus network adapter monitors network traffic at the media independent interface. upon detecting a magic packet* frame, the lan subsystem asserts a wake-up signal th at powers up the computer. depending on the lan implementation, the board supports lan wake capabilities with acpi in the following ways: ? the pci express wake# signal ? the pci bus pme# signal for pci 2.3 compliant lan designs ? the onboard lan subsystem 1.12.2.4 instantly available pc technology caution for instantly available pc technology, th e +5 v standby line from the power supply must be capable of providing adequate +5 v standby current. failure to provide adequate standby current when implementing instantly available pc technology can damage the power supply. instantly available pc technology enables the board to enter the acpi s3 (suspend-to- ram) sleep-state. while in the s3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel led is amber if dual colored, or off if single colored.) when signaled by a wake-up device or event, the system quickly returns to its last known wake state. table 10 on page 43 lists the devices and events that can wake the computer from the s3 state. the board supports the pci bus power management interface specification . add-in boards that also support this specificatio n can participate in power management and can be used to wake the computer. the use of instantly available pc technolo gy requires operating system support and pci 2.3 compliant add-in cards and drivers. 1.12.2.5 resume on ring the operation of resume on ring can be summarized as follows: ? resumes operation from acpi s3 state ? detects incoming call similarly fo r external and internal modems ? requires modem interrupt be unmasked for correct operation
intel desktop board DQ965GF tec hnical product specification 46 1.12.2.6 wake from usb usb bus activity wakes the co mputer from acpi s3 state. note wake from usb requires the use of a usb peripheral that supports wake from usb. 1.12.2.7 wake from ps/2 devices ps/2 device activity wakes the co mputer from an acpi s3 state. 1.12.2.8 pme# signal wake-up support when the pme# signal on the pci bus is a sserted, the computer wakes from an acpi s3, s4, or s5 state (with wake on pme enabled in bios). 1.12.2.9 wake# signal wake-up support when the wake# signal on the pci express bus is asserted, the computer wakes from an acpi s3, s4, or s5 state.
product description 47 1.12.2.10 onboard power indicator leds caution if ac power has been switched off and th e +5 v standby power indicator is still lit, disconnect the power cord befo re installing or removing an y devices connected to the board. failure to do so could damage the board an d any attached devices. caution when connected to ac power, the memory slots on the board will be powered on and in use. a red led (shown in figure 13), located near the me mory slots, will be lit if the memory slots are powered. installing or removing memory while the memory slots are powered may result in damage to both the memory and the board. before installing or removing memory, disconnect the computer from ac power an d wait for the led to go off before proceeding. figure 13 shows the location of the two power indicators: ? +5 v standby power indicator led. the +5 v standby power indicator led is lit when there is standby power still present even when the computer appears to be off. ? memory power indicator led. the memory power indicator led is lit when there is power to the memory slots. om18490 a b item description led color a +5 v standby power indicator led green b memory power indicator led red figure 13. location of the onboard power indicator leds
intel desktop board DQ965GF tec hnical product specification 48 1.13 trusted platform module (tpm) the tpm 1.2 component is specifically desi gned to enhance platform security above- and-beyond the capabilities of today?s software by providing a protected space for key operations and other security critical task s. using both hardware and software, the tpm protects encryption and signature ke ys at their most vulnerable stages? operations when the keys are being used une ncrypted in plain-text form. the tpm is specifically designed to shield unencrypted keys and platform authentication information from software-based attacks. for information about refer to tpm 1.2 http://www.intel.com/design/motherbd/gf/
49 2 technical reference what this chapter contains 2.1 memory map................................................................................... 49 2.2 dma channels................................................................................. 51 2.3 fixed i/o map ................................................................................. 52 2.4 pci configuration space map .......... .................................................. 53 2.5 interrupts ...................................................................................... 54 2.6 pci interrupt routing map ................................................................ 55 2.7 connectors and headers................................................................... 56 2.8 jumper block .................................................................................. 67 2.9 mechanical considerations ........... ..................................................... 68 2.10 electrical considerations ........... ........................................................ 73 2.11 thermal considerations .................................................................... 75 2.12 reliability ....................................................................................... 77 2.13 environmental ................................................................................ 78 2.1 memory map 2.1.1 addressable memory the board utilizes 8 gb of addressable system memory. typically the address space that is allocated for pci conventional bu s add-in cards, pci express configuration space, bios (spi flash), and chipset overhe ad resides above the top of dram (total system memory). on a system that has 8 gb of system memory installed, it is not possible to use all of the installed memo ry due to system address space being allocated for other system critical function s. these functions include the following: ? bios/ spi flash (16 mbits) ? local apic (19 mb) ? digital media interface (40 mb) ? front side bus interrupts (17 mb) ? pci express configuration space (256 mb) ? gmch base address register s, internal graphics ranges , pci express ports (up to 512 mb) ? memory-mapped i/o that is dynamically allocated for pci conventional and pci express add-in cards ? manageability engine support (6 mb) ? base graphics memory su pport (1 mb or 8 mb)
intel desktop board DQ965GF tec hnical product specification 50 the amount of installed memory that can be used will vary based on add-in cards and bios settings. figure 14 shows a schematic of the sy stem memory map. all installed system memory can be used when there is no overlap of system addresses. upper bios area (64 kb) lower bios area (64 kb; 16 kb x 4) add-in card bios and buffer area (128 kb; 16 kb x 8) standard pci/ isa video memory (smm memory) 128 kb dos area (640 kb) 1 mb 960 kb 896 kb 768 kb 640 kb 0 kb 0fffffh 0f0000h 0effffh 0e0000h 0dffffh 0c0000h 0bffffh 0a0000h 09ffffh 00000h flash apic reserved 0 mb 640 kb 1 mb top of usable dram (memory visible to the operating system) pci memory range - contains pci, chipsets, direct media interface (dmi), and ich ranges (approximately 750 mb) dos compatibility memory dram range om18311 ~20 mb 8 gb top of system address space upper 4 gb of address space figure 14. detailed system memory address map
technical reference 51 table 11 lists the system memory map. table 11. system memory map address range (decimal) address range (hex) size description 1024 k - 8388608 k 100000 - 1ffffffff 8191 mb extended memory 960 k - 1024 k f0000 - fffff 64 kb runtime bios 896 k - 960 k e0000 - effff 64 kb reserved 800 k - 896 k c8000 - dffff 96 kb potential available high dos memory (open to the pci bus). dependent on video adapter used. 640 k - 800 k a0000 - c7fff 160 kb video memory and bios 639 k - 640 k 9fc00 - 9ffff 1 kb extended bios data (movable by memory manager software) 512 k - 639 k 80000 - 9fbff 127 kb extended conventional memory 0 k - 512 k 00000 - 7ffff 512 kb conventional memory 2.2 dma channels table 12. dma channels dma channel number data width system resource 0 8 or 16 bits open 1 8 or 16 bits parallel port 2 8 or 16 bits diskette drive 3 8 or 16 bits parallel port (for ecp or epp) 4 8 or 16 bits dma controller 5 16 bits open 6 16 bits open 7 16 bits open
intel desktop board DQ965GF tec hnical product specification 52 2.3 fixed i/o map table 13. i/o map address (hex) size description 0000 - 00ff 256 bytes used by the desktop board DQ965GF. refer to the ich8do data sheet for dynamic addr essing information. 01f0 - 01f7 8 bytes primary parallel ate ide channel command block 0228 - 022f (note 1) 8 bytes lpt3 0278 - 027f (note 1) 8 bytes lpt2 02e8 - 02ef (note 1) 8 bytes com4 02f8 - 02ff (note 1) 8 bytes com2 0378 - 037f 8 bytes lpt1 03b0 - 03bb 12 bytes intel 82q965 gmch 03c0 - 03df 32 bytes intel 82q965 gmch 03e8 - 03ef 8 bytes com3 03f0 - 03f5 6 bytes diskette channel 03f4 - 03f7 4 bytes primary parallel ata ide channel control block 03f8 - 03ff 8 bytes com1 04d0 - 04d1 2 bytes edge/level triggered pic lptn + 400 8 bytes ecp port, lptn base address + 400h 0cf8 - 0cfb (note 2) 4 bytes pci configuration address register 0cf9 (note 3) 1 byte reset control register 0cfc - 0cff 4 bytes pci co nfiguration data register ffa0 - ffa7 8 bytes primary paralle l ata ide bus master registers notes: 1. default, but can be changed to another address range 2. dword access only 3. byte access only note some additional i/o addresses are not availa ble due to ich8do address aliasing. the ich8do data sheet provides more information on address aliasing. for information about refer to obtaining the ich8do data sheet section 1.2 on page 17
technical reference 53 2.4 pci configuration space map table 14. pci configuration space map bus number (hex) device number (hex) function number (hex) description 00 00 00 memory controller of intel 82q965 component 00 01 00 pci express x16 graphics port (note 1) 00 02 00 integrated graphics controller 00 1b 00 intel high definition audio controller 00 1c 00 pci express port 1 00 1c 01 pci express port 2 00 1c 02 pci express port 3 00 1c 03 pci express port 4 00 1c 04 pci express port 5 00 1d 00 usb uhci controller 1 00 1d 01 usb uhci controller 2 00 1d 02 usb uhci controller 3 00 1d 00 usb uhci controller 4 00 1a 01 usb uhci controller 5 00 1d 07 ehci controller #1 00 1a 07 ehci controller #2 00 1e 00 pci bridge 00 1f 00 pci controller 00 1f 01 parallel ata ide controller 00 1f 02 serial ata controller #1 00 1f 05 serial ata controller #2 00 1f 03 smbus controller 00 19 00 gigabit lan controller (note 2) 00 00 pci conventional bus connector 1 (note 2) 01 00 pci conventional bus connector 2 (note 2) 03 00 ieee-1394a controller (optional) 01 00 00 pci express video controller (note 1) notes: 1. present only when a pci express x 16 graphics card is installed. 2. bus number is dynamic and can change based on add-in cards used.
intel desktop board DQ965GF tec hnical product specification 54 2.5 interrupts the interrupts can be routed through eith er the programmable interrupt controller (pic) or the advanced programmable inte rrupt controller (apic) portion of the ich8do component. the pic is supported in windows 98 se and windows me and uses the first 16 interrupts. the apic is supported in windows 2000 and windows xp and supports a total of 24 interrupts. table 15. interrupts irq system resource nmi i/o channel check 0 reserved, interval timer 1 reserved, keyboard buffer full 2 reserved, cascade interrupt from slave pic 3 com2 (note 1) 4 com1 (note 1) 5 lpt2 (plug and play option)/user available 6 diskette drive 7 lpt1 (note 1) 8 real-time clock 9 reserved for ich8do system management bus 10 user available 11 user available 12 onboard mouse port (if pres ent, else user available) 13 reserved, math coprocessor 14 primary ide/serial ata (if present, else user available) 15 secondary ide/serial ata (if present, else user available) 16 (note 2) usb uhci controller 1 / usb uhci controller 4 (through pirqa) 17 (note 2) ac ?97 audio/modem/user available (through pirqb) 18 (note 2) ich8do usb controller 3 (through pirqc) 19 (note 2) ich8do usb controller 2 (through pirqd) 20 (note 2) ich8do lan (through pirqe) 21 (note 2) user available (through pirqf) 22 (note 2) user available (through pirqg) 23 (note 2) ich8do usb 2.0 ehci controller/ user available (through pirqh) notes: 1. default, but can be changed to another irq. 2. available in apic mode only.
technical reference 55 2.6 pci interrupt routing map this section describes interrupt sharing an d how the interrupt signals are connected between the pci bus connectors and onboar d pci devices. the pci specification specifies how interrupts can be shared between devices attached to the pci bus. in most cases, the small amount of latency a dded by interrupt sharing does not affect the operation or throughput of the device s. in some special cases where maximum performance is needed from a device, a pci device should not share an interrupt with other pci devices. use the following information to avoid sharing an interrupt with a pci add-in card. pci devices are categorized as follows to specify their interrupt grouping: ? inta: by default, all add-in cards that require only one interrupt are in this category. for almost all cards that re quire more than one interrupt, the first interrupt on the card is also classified as inta. ? intb: generally, the second interrupt on add-in cards that require two or more interrupts is classified as intb. (t his is not an absolute requirement.) ? intc and intd: generally, a third interrupt on add-in cards is classified as intc and a fourth interrupt is classified as intd. the ich8do has eight programmable interrupt request (pirq) input signals. all pci interrupt sources either onboard or from a pci add-in card connect to one of these pirq signals. some pci inte rrupt sources are electrically tied together on the board and therefore share th e same interrupt. table 16 shows an example of how the pirq signals are routed. table 16. pci interrupt routing map ich8do pirq signal name pci interrupt source pirqa pirqb pirqc pirqd pirqe pirqf pirqg pirqh ich8do lan inta pci bus connector 1 intd inta intb intc pci bus connector 2 intc intb inta intd ieee-1394a controller inta note in pic mode, the ich8do can connect each pirq line internally to one of the irq signals (3, 4, 5, 6, 7, 9, 10, 11, 12, 14, and 15). typically, a device that does not share a pirq line will have a unique inte rrupt. however, in certain interrupt- constrained situations, it is possible for two or more of the pirq lines to be connected to the same irq signal. refer to table 15 for the allocation of pirq lines to irq signals in apic mode. pci interrupt assignments to usb ports, se rial ata ports, and pci express ports are dynamic.
intel desktop board DQ965GF tec hnical product specification 56 2.7 connectors and headers caution only the following connectors have overcurrent protection: back panel and front panel usb, ps/2, and vga. the other internal connectors/headers ar e not overcurrent protected and should connect only to devices inside the computer ?s chassis, such as fans and internal peripherals. do not use these connectors/ headers to power devices external to the computer?s chassis. a fault in the load pr esented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. this section describes the board?s conne ctors and headers. the connectors and headers can be divided into these groups: ? back panel i/o connectors (see page 57) ? component-side connectors and headers (see page 58)
technical reference 57 2.7.1 back panel connectors figure 15 shows the locations of the back panel connectors. om18439 b a c g e f j i h k d item description a ps/2 mouse port (optional) b ps/2 keyboard port (optional) c parallel port d vga port e ieee-1394a (optional) f usb ports [4] g lan h usb ports [2] i audio line in j mic in k audio line out figure 15. back panel connectors note the back panel audio line out connector is de signed to power headphones or amplified speakers only. poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
intel desktop board DQ965GF tec hnical product specification 58 2.7.2 component-side connectors and headers figure 16 shows the locations of the co mponent-side connectors and headers. p o n m l k j i h f g e d c b a q r s t u om18442 1 4 2 1 1 1 9 8 1 2 24 1 1 1 9 1 2 1 2 10 10 2 1 1 2 10 1 2 16 1 2 9 10 figure 16. component-side connectors and headers
technical reference 59 table 17 lists the component-side co nnectors and headers identified in figure 16. table 17. component-side connectors and headers shown in figure 16 item/callout from figure 16 description a ieee-1394a front panel header (optional) b front panel audio header c pci conventional bus add-in card connector 1 d pci express x1 connector e pci express x16 connector f processor core power connector g rear chassis fan header h processor fan header i serial port header j diskette drive connector k main power connector l front chassis fan header m chassis intrusion header n auxiliary front panel power led header o front panel header p serial ata connectors [6] q front panel usb header r front panel usb header s parallel ate ide connector t pci conventional bus add-in card connector 2 u high definition audio header
intel desktop board DQ965GF tec hnical product specification 60 table 18. high definition audio link header pin signal name pin signal name 1 bclk 2 ground 3 rst 4 3.3 v/1.5 v i/o 5 sync 6 ground 7 sdo 8 3.3v_core 9 sdi 10 +12 v 11 no connect 12 key (no pin) 13 no connect 14 3.3 v/1.5v stby 15 no connect 16 ground table 19. serial ata connectors pin signal name 1 ground 2 txp 3 txn 4 ground 5 rxn 6 rxp 7 ground table 20. chassis intrusion header pin signal name 1 intruder 2 ground table 21. serial port header pin signal name pin signal name 1 dcd 2 rxd# 3 txd# 4 dtr 5 ground 6 dsr 7 rts 8 cts 9 ri 10 key (no pin) table 22. front and rear chassis fan headers pin signal name 1 control 2 +12 v 3 tach
technical reference 61 table 23. processor fan header pin signal name 1 ground 2 +12 v 3 fan_tach 4 fan_control table 24. front panel audio header pin signal name pin signal name 1 [port 1] left channel 2 ground 3 [port 1] right channel 4 presence# (dongle present) 5 [port 2] right channel 6 [port 1] sense_return 7 sense_send (jack dete ction) 8 key (no pin) 9 [port 2] left channel 10 [port 2] sense_return
intel desktop board DQ965GF tec hnical product specification 62 2.7.2.1 add-in card connectors the board has the following add-in card connectors: ? pci express x16: one connector supportin g simultaneous transfer speeds up to 4 gbytes/sec of peak bandwi dth per direction and up to 8 gbytes/sec concurrent bandwidth ? pci express x1: one pci express x1 connector. the x1 interface supports simultaneous transfer speeds up to 250 mbytes/sec of peak bandwidth per direction and up to 500 mbytes /sec concurrent bandwidth ? pci conventional (rev 2.3 compliant) bus: two pci conventional bus add-in card connectors. the smbus is routed to pci conventional bus connector 2 only . pci conventional bus add-in cards with sm bus support can access sensor data and other information residing on the board. note the following considerations for the pci conventional bus connectors: ? all of the pci conventional bus co nnectors are bus master capable. ? smbus signals are routed to pci convention al bus connector 2. this enables pci conventional bus add-in boards with smbu s support to access sensor data on the board. the specific smbus signals are as follows: ? the smbus clock line is connected to pin a40. ? the smbus data line is connected to pin a41.
technical reference 63 2.7.2.2 power supply connectors the board has the following power supply connectors: ? main power ? a 2 x 12 connector. this connector is compatible with 2 x 10 connectors previously used on intel desk top boards. the board supports the use of atx12v power supplies with either 2 x 10 or 2 x 12 main power cables. when using a power supply with a 2 x 10 main po wer cable, attach that cable on the rightmost pins of the main power co nnector, leaving pins 11, 12, 23, and 24 unconnected. ? processor core power ? a 2 x 2 connector. this connector provides power directly to the processor voltage regulator and must always be used. failure to do so will prevent the board from booting. table 25. processor core power connector pin signal name pin signal name 1 ground 2 ground 3 +12 v 4 +12 v table 26. main power connector pin signal name pin signal name 1 +3.3 v 13 +3.3 v 2 +3.3 v 14 -12 v 3 ground 15 ground 4 +5 v 16 ps-on# (power supply remote on/off) 5 ground 17 ground 6 +5 v 18 ground 7 ground 19 ground 8 pwrgd (power good) 20 no connect 9 +5 v (standby) 21 +5 v 10 +12 v 22 +5 v 11 +12 v (note) 23 +5 v (note) 12 2 x 12 connector detect (note) 24 ground (note) note: when using a 2 x 10 power supply cable, this pin will be unconnected.
intel desktop board DQ965GF tec hnical product specification 64 2.7.2.3 front panel header this section describes the functi ons of the front panel header. table 27 lists the signal names of the front panel header. figure 17 is a connection diagram for the front panel header. table 27. front panel header pin signal in/ out description pin signal in/ out description hard drive activity led power led 1 hd_pwr out hard disk led pull-up to +5 v 2 hdr_blnk_ grn out front panel green led 3 hda# out hard disk active led 4 hdr_blnk_ yel out front panel yellow led reset switch on/off switch 5 ground ground 6 fpbut_in in power switch 7 fp_reset# in reset switch 8 ground ground power not connected 9 +5 v power 10 n/c not connected om18331 hard drive activity led reset switch +5 v dc n/c power switch + - + - 1 9 87 65 4 2 3 dual- colored power led single- colored power led + - figure 17. connection diagram for front panel header 2.7.2.3.1 hard drive activity led header pins 1 and 3 can be connected to an led to provide a visual indicator that data is being read from or written to a hard drive. proper led function requires one of the following: ? a serial ata hard drive connected to an onboard serial ata connector ? a parallel ata ide hard drive connected to an onboard parallel ata ide connector
technical reference 65 2.7.2.3.2 reset switch header pins 5 and 7 can be connected to a momentar y single pole, single throw (spst) type switch that is normally open. when the swit ch is closed, the board resets and runs the post. 2.7.2.3.3 power/sleep led header pins 2 and 4 can be connected to a one- or two-color led. table 28 shows the possible states for a one-color led. table 29 shows the possible states for a two-color led. table 28. states for a one-color power led led state description off power off/sleeping steady green running table 29. states for a two-color power led led state description off power off steady green running steady yellow sleeping note the colors listed in table 28 and table 29 are suggested colors only. actual led colors are product- or customer-specific. 2.7.2.3.4 power switch header pins 6 and 8 can be connected to a front panel momentary-contact power switch. the switch must pull the sw_on# pin to ground for at least 50 ms to signal the power supply to switch on or off. (the time requ irement is due to inte rnal debounce circuitry on the board.) at least two seconds must pass before the power supply will recognize another on/off signal. 2.7.2.4 auxiliary front panel power led header pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. table 30. auxiliary front panel power led header pin signal name in/out description 1 hdr_blnk_grn out front panel green led 2 not connected 3 hdr_blnk_yel out front panel yellow led
intel desktop board DQ965GF tec hnical product specification 66 2.7.2.5 front panel usb headers figure 18 is a connection diagram for the front panel usb headers. # integrator?s notes ? the +5 v dc power on the front panel usb headers is fused. ? use only a front panel usb connector that conforms to the usb 2.0 specification for high-speed usb devices. om18317 key (no pin) no connect power (+5 v dc) d- d+ ground d+ ground d- power (+5 v dc) one usb port one usb port 10 8 7 6 5 4 2 1 3 figure 18. connection diagram for front panel usb headers 2.7.2.6 front panel ieee-1394a header (optional) figure 19 is a connection diagram for the optional ieee-1394a header. om18332 key (no pin) tpa+ +12 v dc tpa- ground tpb+ tpb- ground ground +12 v dc 10 87 65 4 2 1 3 figure 19. connection diagram for ieee-1394a header # integrator?s notes ? the +12 v dc power on the ieee-1394a header is fused. ? the ieee-1394a header provides one ieee-1394a port.
technical reference 67 2.8 jumper block caution do not move the jumper with the power on. always turn off the power and unplug the power cord from the computer before chan ging a jumper setting. otherwise, the board could be damaged. figure 20 shows the location of the jumper block. the jumper determines the bios setup program?s mode. table 31 lists the jumper settings for the three modes: normal, configure, and recovery. when the jumper is set to configure mode and the computer is powered-up, the bios compares the processor version and the microcode version in the bios and reports if the two match. om18445 321 figure 20. location of the jumper block table 31. bios setup configuration jumper settings function/mode jumper setting configuration normal 1-2 321 the bios uses current configuration information and passwords for booting. configure 2-3 321 after the post runs, setup runs automatically. the maintenance menu is displayed. recovery none 321 the bios attempts to recover the bios configuration. see section 3.7 for more information on bios recovery.
intel desktop board DQ965GF tec hnical product specification 68 2.9 mechanical considerations 2.9.1 form factor the board is designed to fit into an at x- or microatx-form-factor chassis. figure 21 illustrates the mechanical form factor of the board. dimensions are given in inches [millimeters]. the outer dimensions ar e 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. om18444 5.200 [132.08] 6.450 [163.83] 6.200 [157.48] 2.600 [66.04] 3.100 [78.74] 3.150 [80.01] 2.850 [72.39] 0.00 1.800 [45.72] 0.00 6.500 [165.10] 6.100 [154.94] figure 21. board dimensions
technical reference 69 2.9.2 i/o shield the back panel i/o shield for the board must meet specific dimension and material requirements. systems based on this boar d need the back panel i/o shield to pass certification testing. table 32 lists the compatible i/o shield design drawings. table 32. compatible i/o shields ieee-1394a connector on back panel? ps/2 connectors on back panel? for i/o shield dimensions, see? yes yes figure 22 yes no figure 23 no no figure 24 dimensions are given in inches [millimeters]. the figures indicate the position of each cutout. additional design considerations for i/o shields relative to chassis requirements are described in the atx specification. note the i/o shield drawings are for reference only. i/o shields compliant with the atx specification are available from intel.
intel desktop board DQ965GF tec hnical product specification 70 [44.9 ? 0.12] 1.768 ? 0.005 [15 ? 0.25] 0.591 ? 0.010 1.890 [48] 0.465 [11.81] 0.00 [0.00] 0.276 [7.01] 0.884 [22.45] 0.00 [0.00] 0.326 [8.27] 0.780 [19.81] 3.288 [83.52] 3.822 [97.08] 4.573 [116.15] 5.783 [146.88] a 0.465 [11.81] a 0.558 [14.17] 8x r0.5 min [20 ? 0.254] 0.787 ? 0.010 typ [159.2 ? 0.12] 6.268 ? 0.005 [1.6 ? 0.12] 0.063 ? 0.005 [162.3] 6.390 ref [1.55] 0.061 ref 0.039 [1] om18446 1.927 [48.95] 0.474 [12.04] figure 22. i/o shield dimensions for boards with ieee-1394a and ps/2 connectors
technical reference 71 [44.9 ? 0.12] 1.768 ? 0.005 [15 ? 0.25] 0.591 ? 0.010 1.890 [48] 0.00 [0.00] 0.276 [7.01] 0.884 [22.45] 0.00 [0.00] 0.780 [19.81] 3.288 [83.52] 3.822 [97.08] 4.573 [116.15] 5.783 [146.88] a 0.465 [11.81] a 0.558 [14.17] 8x r0.5 min [20 ? 0.254] 0.787 ? 0.010 typ [159.2 ? 0.12] 6.268 ? 0.005 [1.6 ? 0.12] 0.063 ? 0.005 [162.3] 6.390 ref [1.55] 0.061 ref 0.039 [1] om18447 1.927 [48.95] 0.474 [12.04] figure 23. i/o shield dimensions for boards without ps/2 connectors
intel desktop board DQ965GF tec hnical product specification 72 [44.9 ? 0.12] 1.768 ? 0.005 [15 ? 0.25] 0.591 ? 0.010 1.890 [48] 0.00 [0.00] 0.276 [7.01] 0.884 [22.45] 0.00 [0.00] 0.780 [19.81] 3.822 [97.08] 4.573 [116.15] 5.783 [146.88] a 0.465 [11.81] a 0.558 [14.17] 8x r0.5 min [20 ? 0.254] 0.787 ? 0.010 typ [159.2 ? 0.12] 6.268 ? 0.005 [1.6 ? 0.12] 0.063 ? 0.005 [162.3] 6.390 ref [1.55] 0.061 ref 0.039 [1] om18448 1.927 [48.95] 0.474 [12.04] figure 24. i/o shield dimensions for boards without ieee-1394a and ps/2 connectors
technical reference 73 2.10 electrical considerations 2.10.1 dc loading table 33 lists the dc loading characteristics of the board. this data is based on a dc analysis of all active components within the board that impact its power delivery subsystems. the analysis does not include pci add-in cards. minimum values assume a light load placed on the board that is sim ilar to an environment with no applications running and no usb current draw. maximum values assume a load placed on the board that is similar to a heavy gaming environment with a 500 ma current draw per usb port. these calculations are not based on specific processor values or memory configurations but are based on the mi nimum and maximum cu rrent draw possible from the board?s power delivery subsyste ms to the processor, memory, and usb ports. use the datasheets for add-in cards, such as pci, to determine the overall system power requirements. the selection of a powe r supply at the system level is dependent on the system?s usage model and not necessar ily tied to a particular processor speed. table 33. dc loading characteristics dc current at: mode dc power -12 v +12 v1 +12 v2 (cpu) +5 v +3.3 v +5 vsb minimum loading 43.13 w 0.00 0.40 1.79 1.80 2.00 0.25 [s0] 0.25 [s3] maximum loading 532.98 w 0.30 11.50 16.77 23.96 19.52 1.17 [s0] 3.89 [s3] 2.10.2 fan header current capability caution the processor fan must be connected to the processor fan header, not to a chassis fan header. connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. table 34 lists the current capability of the fan headers. table 34. fan header current capability fan header maximum available current processor fan 3.0 a front chassis fan 1.5 a rear chassis fan 1.5 a
intel desktop board DQ965GF tec hnical product specification 74 2.10.3 add-in board considerations the board is designed to provide 2 a (average ) of +5 v current for each add-in board. the total +5 v current draw for add-in bo ards for a fully loaded board (all three expansion slots and the pci express x16 connector filled) must not exceed 8 a. 2.10.4 power supply considerations caution the +5 v standby line from the power supply must be capable of providing adequate +5 v standby current. failure to do so can damage the power supply. the total amount of standby current required depe nds on the wake devices supported and manufacturing options. system integrators should refer to the power usage values listed in table 33 when selecting a power supply for use with the board. additional power required will depend on configurations chosen by the integrator. the power supply must comply with the indi cated parameters of the atx form factor specification. ? the potential relation between 3.3 vdc and +5 vdc power rails ? the current capability of the +5 vsb line ? all timing parameters ? all voltage tolerances
technical reference 75 2.11 thermal considerations caution failure to ensure appropriate airflow may re sult in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. for a list of chassis that have been tested with intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm all responsibility for determining the adeq uacy of any thermal or system design remains solely with the reader. intel ma kes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. caution ensure that the ambient temperature does not exceed the board?s maximum operating temperature. failure to do so could cause components to exceed their maximum case temperature and malfunction. for info rmation about the maximum operating temperature, see the environmental specifications in section 2.13. caution ensure that proper airflow is maintained in the processor voltage regulator circuit. failure to do so may result in damage to the voltage regu lator circuit. the processor voltage regulator area (shown in figure 25) can reach a temperature of up to 85 o c in an open chassis.
intel desktop board DQ965GF tec hnical product specification 76 figure 25 shows the locations of the localized high temperature zones. d om18443 c b a item description a processor voltage regulator area b processor c intel 82q965 gmch d intel 82801ho ich8do figure 25. localized high temperature zones
technical reference 77 table 35 provides maximum case temperatur es for the board components that are sensitive to thermal changes. the operating temperature, current load, or operating frequency could affect case temperatures. maximum case temperatures are important when considering proper airflow to cool the board. table 35. thermal considerations for components component maximum case temperature processor for processor case temper ature, see processor datasheets and processor specification updates intel 82q965 gmch 97 o c (under bias) intel 82801ho ich8do 92 o c (under bias) for information about refer to processor datasheets and specification updates section 1.2, page 17 2.12 reliability the mean time between failures (mtbf) pred iction is calculated using component and subassembly random failure rates. the calculation is based on the bellcore reliability prediction procedure, tr-nwt-000332, issue 4, september 1991. the mtbf prediction is used to estimate repa ir rates and spare parts requirements. the mtbf data is calculated from pred icted data at 55 oc. the desktop board DQ965GF mtbf is 117,142 hours.
intel desktop board DQ965GF tec hnical product specification 78 2.13 environmental table 36 lists the environmental specifications for the board. table 36. desktop board DQ965GF environmental specifications parameter specification temperature non-operating -40 c to +70 c operating 0 c to +55 c shock unpackaged 50 g trape zoidal waveform velocity change of 170 inches/second2 packaged half sine 2 millisecond product weight (pounds) free fall (inches) velocity change (inches/sec2) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 vibration unpackaged 5 hz to 20 hz: 0.01 g2 hz sloping up to 0.02 g2 hz 20 hz to 500 hz: 0.02 g2 hz (flat) packaged 10 hz to 40 hz: 0.015 g2 hz (flat) 40 hz to 500 hz: 0.015 g2 hz sloping down to 0.00015 g2 hz
79 3 overview of bios features what this chapter contains 3.1 introduction ................................................................................... 79 3.2 bios flash memory organization .. ..................................................... 80 3.3 resource configuration ............ ........................................................ 80 3.4 system management bios (smbios)................................................. 81 3.5 legacy usb support ........................................................................ 82 3.6 bios updates ................................................................................. 82 3.7 bios recovery................................................................................ 83 3.8 boot options................................................................................... 84 3.9 adjusting boot speed....................................................................... 85 3.10 bios security features .................................................................... 86 3.1 introduction the board uses an intel bios that is stored in the serial periph eral interface flash memory (spi flash) and can be updated using a disk-based program. the spi flash contains the bios setup program, post, the pci auto-configuration utility, and plug and play support. the bios displays a message during post id entifying the type of bios and a revision code. the initial production bi oss are identified as co96510j.86a. when the bios setup configuration jumper is set to configure mode and the computer is powered-up, the bios compares the cpu version and the microcode version in the bios and reports if the two match. the bios setup program can be used to vi ew and change the bios settings for the computer. the bios setup program is acce ssed by pressing the key after the power-on self-test (post) memory test begi ns and before the operating system boot begins. the menu bar is shown below. maintenance main advanced security power boot exit note the maintenance menu is displayed only when the board is in configure mode. section 2.8 on page 67 shows how to put the board in configure mode.
intel desktop board DQ965GF tec hnical product specification 80 table 37 lists the bios setup program menu features. table 37. bios setup program menu bar maintenance main advanced security power boot exit clears passwords and displays processor information displays processor and memory configura- tion configures advanced features available through the chipset sets passwords and security features configures power manage- ment features and power supply controls selects boot options saves or discards changes to setup program options table 38 lists the function ke ys available for menu screens. table 38. bios setup program function keys bios setup program function key description < > or < > selects a different menu screen (mov es the cursor left or right) < > or < > selects an item (moves the cursor up or down) selects a field (not implemented) executes command or selects the submenu load the default configuration values for the current menu save the current values an d exits the bios setup program exits the menu 3.2 bios flash memory organization the serial peripheral interf ace flash memory (spi flash) includes a 16 mbit (2048 kb) flash memory device 3.3 resource configuration 3.3.1 pci autoconfiguration the bios can automatically configure pci de vices. pci devices may be onboard or add-in cards. autoconfiguration lets a user insert or remove pc i cards without having to configure the system. when a user turn s on the system after adding a pci card, the bios automatically configures interru pts, the i/o space, and other system resources. any interrupts set to available in setup are considered to be available for use by the add-in card.
overview of bios features 81 3.3.2 pci ide support if you select auto in the bios setup prog ram, the bios automatically sets up the pci ide connector with independent i/o ch annel support. the ide interface supports hard drives up to ata-66/100/133 and reco gnizes any atapi compliant devices, including cd-rom drives, tape drives, and ul tra dma drives. the bios determines the capabilities of each drive and configures them to optimize capacity and performance. to take advantage of the high capacities typically available today, hard drives are automatically configured for logical block a ddressing (lba) and to pio mode 3 or 4, depending on the capability of the drive. you can override the auto-configuration options by specifying manual configuration in the bios setup program. to use ata-66/100/133 features the following items are required: ? an ata-66/100/133 peripheral device ? an ata-66/100/133 compatible cable ? ata-66/100/133 operating system device drivers note do not connect an ata device as a slave on the same ide cable as an atapi master device. for example, do not connect an ata hard drive as a slave to an atapi cd-rom drive. 3.4 system management bios (smbios) smbios is a desktop management interfac e (dmi) compliant method for managing computers in a managed network. the main component of smbios is the management information format (mif) database, which contains information about the computing system and its components. using smbios, a system admi nistrator can obtain the system types, capabilities, operational status, and installation dates for system components. the mif database defines the data and provides th e method for accessing this information. the bios enables applications such as third-party management software to use smbios. the bios stores and report s the following smbios information: ? bios data, such as the bios revision level ? fixed-system data, such as peripher als, serial numbers , and asset tags ? resource data, such as memory si ze, cache size, and processor speed ? dynamic data, such as event detection and error logging non-plug and play operating systems, such as windows nt*, re quire an additional interface for obtaining the smbios informat ion. the bios supports an smbios table interface for such operating systems. using this support , an smbios service-level application running on a non-plug and play operating system can obtain the smbios information.
intel desktop board DQ965GF tec hnical product specification 82 3.5 legacy usb support legacy usb support enables usb devices to be used even when the operating system?s usb drivers are not yet available. legacy usb support is used to access the bios setup program, and to install an op erating system that supports usb. by default, legacy usb suppo rt is set to enabled. legacy usb support operates as follows: 1. when you apply power to the comput er, legacy support is disabled. 2. post begins. 3. legacy usb support is enabled by the bios allowing you to use a usb keyboard to enter and configure the bios setup program and the maintenance menu. 4. post completes. 5. the operating system loads. while the operating system is loading, usb keyboards and mice are recognized and ma y be used to configure the operating system. (keyboards and mice are not recogn ized during this period if legacy usb support was set to disabled in the bios setup program.) 6. after the operating system loads the usb drivers, all legacy and non-legacy usb devices are recognized by the operating system, and legacy usb support from the bios is no longer used. to install an operating system that supports usb, verify that legacy usb support in the bios setup program is set to enabled and follow the operating system?s installation instructions. 3.6 bios updates the bios can be updated using either of the following utilities, which are available on the intel world wide web site: ? intel ? express bios update utility, which enables automated updating while in the windows environment. using this utility, the bios can be updated from a file on a hard disk, a usb drive (a thumb drive or a usb hard drive), or a cd-rom, or from the file location on the web. ? intel ? flash memory update utility, which requires booting from dos. using this utility, the bios can be updated from a file on a hard disk, a usb drive (a thumb drive or a usb hard drive), or a cd-rom. both utilities verify that the updated bios matches the target system to prevent accidentally installing an incompatible bios. note review the instructions distributed with th e upgrade utility before attempting a bios update. for information about refer to the intel world wide web site section 1.2, page 17
overview of bios features 83 3.6.1 language support the bios setup program and help messages ar e supported in us english. additional languages are available in the integrator?s toolkit utility. check the intel website for details. 3.6.2 custom splash screen during post, an intel ? splash screen is displayed by de fault. this splash screen can be augmented with a custom splash screen. the integrator?s toolkit that is available from intel can be used to cr eate a custom splash screen. note if you add a custom splash screen, it will share space with the intel branded logo. for information about refer to the intel world wide web site section 1.2, page 17 3.7 bios recovery it is unlikely that anything will interrupt a bios update; however, if an interruption occurs, the bios could be damaged. table 39 lists the drives and media types that can and cannot be used for bios recovery. the bios recovery media does not need to be made bootable. table 39. acceptable drives/media types for bios recovery media type can be used for bios recovery? cd-rom drive connected to the parallel ata interface yes cd-rom drive connected to th e serial ata interface yes usb removable drive (a usb t humb drive, for example) yes usb diskette drive (with a 1.44 mb diskette) no usb hard disk drive no legacy diskette drive (with a 1.44 mb diskette) connected to the legacy diskette drive interface no for information about refer to bios recovery http://support.intel .com/support/mothe rboards/desktop
intel desktop board DQ965GF tec hnical product specification 84 3.8 boot options in the bios setup program, the user can ch oose to boot from a diskette drive, hard drives, cd-rom, or the network. the default setting is for the diskette drive to be the first boot device, the hard drive second, and the atapi cd-rom third. the fourth device is disabled. 3.8.1 cd-rom boot booting from cd-rom is supported in compliance to the el torito bootable cd-rom format specification. under the boot me nu in the bios setup program, atapi cd- rom is listed as a boot device. boot devices are defined in pr iority order. accordingly, if there is not a bootable cd in the cd-rom drive, the system will attempt to boot from the next defined drive. 3.8.2 network boot the network can be selected as a boot device. this selection allows booting from the onboard lan or a network add-in card with a remote boot rom installed. pressing the key during post automati cally forces booting from the lan. to use this key during post, the user access le vel in the bios setup program's security menu must be set to full. 3.8.3 booting without attached devices for use in embedded applications, the bios has been designed so that after passing the post, the operating system loader is in voked even if the following devices are not present: ? video adapter ? keyboard ? mouse 3.8.4 changing the default boot device during post pressing the key during post causes a boot device menu to be displayed. this menu displays the list of available boot de vices (as set in the bios setup program?s boot device priority submenu). table 40 lists the boot device menu options. table 40. boot device menu options boot device menu function keys description < > or < > selects a default boot device exits the menu, saves change s, and boots from the selected device exits the menu without saving changes
overview of bios features 85 3.9 adjusting boot speed these factors affect system boot speed: ? selecting and configuring peripherals properly ? optimized bios boot parameters 3.9.1 peripheral selection and configuration the following techniques help improve system boot speed: ? choose a hard drive with parameters such as ?power-up to data ready? less than eight seconds, that minimize hard drive startup delays. ? select a cd-rom drive with a fast initialization rate. this rate can influence post execution time. ? eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in post. th ese features may add time to the boot process. ? try different monitors. some monitors initialize and communicate with the bios more quickly, which enables the system to boot more quickly. 3.9.2 bios boot optimizations use of the following bios setup program se ttings reduces the post execution time. ? in the boot menu, set the hard disk drive as the first boot device. as a result, the post does not first seek a diskette driv e, which saves about one second from the post execution time. ? in the peripheral configuration submenu, disable the lan device if it will not be used. this can reduce up to four seconds of option rom boot time. note it is possible to optimize the boot proce ss to the point where the system boots so quickly that the intel logo screen (or a cust om logo splash screen) will not be seen. monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screen s and post messages cannot be seen. this boot time may be so fast that some drives might be no t be initialized at all. if this condition should occur, it is possibl e to introduce a programmable delay ranging from three to 30 seconds (using the hard disk pre-delay feature of the advanced menu in the drive configuration subm enu of the bios setup program).
intel desktop board DQ965GF tec hnical product specification 86 3.10 bios security features the bios includes security features that restrict access to the bios setup program and who can boot the computer. a superv isor password and a user password can be set for the bios setup program and for booting the computer, with the following restrictions: ? the supervisor password gives unrestricte d access to view and change all the setup options in the bios setup program. this is the supervisor mode. ? the user password gives restri cted access to view and ch ange setup options in the bios setup program. this is the user mode. ? if only the supervisor password is set, pressing the key at the password prompt of the bios setup program allows the user restricted access to setup. ? if both the supervisor and user passwor ds are set, users can enter either the supervisor password or the user password to access setup. users have access to setup respective to which password is entered. ? setting the user password restricts who can boot the computer. the password prompt will be displayed before the computer is booted. if only the supervisor password is set, the computer boots with out asking for a password. if both passwords are set, the user can enter ei ther password to boot the computer. ? for enhanced security, use different pa sswords for the supervisor and user passwords. ? valid password characters are a-z, a-z, and 0-9. passwords may be up to 16 characters in length. table 41 shows the effects of setting the supervisor password and user password. this table is for reference only and is not displayed on the screen. table 41. supervisor and user password functions password set supervisor mode user mode setup options password to enter setup password during boot neither can change all options (note) can change all options (note) none none none supervisor only can change all options can change a limited number of options supervisor password supervisor none user only n/a can change all options enter password clear user password user user supervisor and user set can change all options can change a limited number of options supervisor password enter password supervisor or user supervisor or user note: if no password is set, any user can change all setup options.
87 4 error messages and beep codes what this chapter contains 4.1 speaker ......................................................................................... 87 4.2 bios beep codes ............................................................................ 87 4.3 bios error messages ....................................................................... 87 4.4 port 80h post codes ....................................................................... 88 4.1 speaker the board-mounted speaker provides audi ble error code (beep code) information during post. for information about refer to the location of the onboard speaker figure 1, page 14 4.2 bios beep codes whenever a recoverable error occurs duri ng post, the bios displays an error message describing the problem (see table 42). table 42. beep codes type pattern frequency memory error three long beeps 1280 hz thermal warning four alternating beeps: high tone, low tone, high tone, low tone high tone: 2000 hz low tone: 1600 hz 4.3 bios error messages table 43 lists the error messages and pr ovides a brief description of each. table 43. bios error messages error message explanation cmos battery low the battery may be losi ng power. replace the battery soon. cmos checksum bad the cmos checksum is incorrect. cm os memory may have been corrupted. run setup to reset values. memory size decreased memory size has decr eased since the last boot. if no memory was removed then memory may be bad. no boot device available system did not find a device to boot.
intel desktop board DQ965GF tec hnical product specification 88 4.4 port 80h post codes during the post, the bios generates diagno stic progress codes (post-codes) to i/o port 80h. if the post fails, execution stops and the last post code generated is left at port 80h. this code is useful for de termining the point wher e an error occurred. displaying the post-codes requires a pci bu s add-in card, often called a post card. the post card can decode the port and disp lay the contents on a medium such as a seven-segment display. note the post card must be installed in pci bus connector 1. the following tables provide information about the post codes generated by the bios: ? table 44 lists the port 80h post code ranges ? table 45 lists the port 80h post codes themselves ? table 46 lists the port 80h post sequence note in the tables listed above, all post codes and range values are listed in hexadecimal. table 44. port 80h post code ranges range category/subsystem 00 ? 0f debug codes: can be used by any peim/driver for debug. 10 ? 1f host processors: 1f is an unrecoverable cpu error. 20 ? 2f memory/chipset: 2f is no memory detected or no useful memory detected. 30 ? 3f recovery: 3f indicated recovery failure. 40 ? 4f reserved for future use. 50 ? 5f i/o busses: pci, usb, i sa, ata, etc. 5f is an unrecov erable error. start with pci. 60 ? 6f reserved for future use (for new busses). 70 ? 7f output devices: all output consoles. 7f is an unrecoverable error. 80 ? 8f reserved for future use (new output console codes). 90 ? 9f input devices: keyboard/mouse. 9f is an unrecoverable error. a0 ? af reserved for future use (new input console codes). b0 ? bf boot devices: includes fixed media and removable media. bf is an unrecoverable error. c0 ? cf reserved for future use. d0 ? df boot device selection. e0 ? ff f0 ? ff: ff processor exception. e0 ? ee: miscellaneous codes. see table 45. ef boot/s3: resume failure.
error messages and beep codes 89 table 45. port 80h post codes post code description of post operation host processor 10 power-on initialization of the host processor (boot strap processor) 11 host processor cache initialization (including aps) 12 starting application processor initialization 13 smm initialization chipset 21 initializing a chipset component memory 22 reading spd from memory dimms 23 detecting presence of memory dimms 24 programming timing parameters in the memory controller and the dimms 25 configuring memory 26 optimizing memory settings 27 initializing memory, such as ecc init 28 testing memory pci bus 50 enumerating pci busses 51 allocating resources to pci bus 52 hot plug pci controller initialization 53 ? 57 reserved for pci bus usb 58 resetting usb bus 59 reserved for usb ata/atapi/sata 5a resetting pata/sata bus and all devices 5b reserved for ata smbus 5c resetting smbus 5d reserved for smbus local console 70 resetting the vga controller 71 disabling the vga controller 72 enabling the vga controller remote console 78 resetting the console controller 79 disabling the console controller 7a enabling the console controller continued
intel desktop board DQ965GF tec hnical product specification 90 table 45. port 80h post codes (continued) post code description of post operation keyboard (ps2 or usb) 90 resetting keyboard 91 disabling keyboard 92 detecting presence of keyboard 93 enabling the keyboard 94 clearing keyboard input buffer 95 instructing keyboard controller to run self test (ps2 only) mouse (ps2 or usb) 98 resetting mouse 99 disabling mouse 9a detecting presence of mouse 9b enabling mouse fixed media b0 resetting fixed media b1 disabling fixed media b2 detecting presence of a fixed me dia (ide hard drive detection etc.) b3 enabling/configuring a fixed media removable media b8 resetting removable media b9 disabling removable media ba detecting presence of a removable media (ide, cd-rom detection, etc.) bc enabling/configuring a removable media bds d y trying boot selection y (y=0 to 15) pei core e0 started dispatching peims (emitted on first report of ef i_sw_pc_init_begin efi_sw_pei_pc_handoff_to_next) e2 permanent memory found e1, e3 reserved for pei/peims dxe core e4 entered dxe phase e5 started dispatching drivers e6 started connecting drivers continued
error messages and beep codes 91 table 45. port 80h post codes (continued) post code description of post operation dxe drivers e7 waiting for user input e8 checking password e9 entering bios setup eb calling legacy option roms runtime phase/efi os boot f4 entering sleep state f5 exiting sleep state f8 efi boot service exitbootservices ( ) has been called f9 efi runtime service setvirtu aladdressmap ( ) has been called fa efi runtime service resetsystem ( ) has been called peims/recovery 30 crisis recovery has initiated per user request 31 crisis recovery has initiated by software (corrupt flash) 34 loading recovery capsule 35 handing off control to the recovery capsule 3f unable to recover
intel desktop board DQ965GF tec hnical product specification 92 table 46. typical port 80h post sequence post code description 21 initializing a chipset component 22 reading spd from memory dimms 23 detecting presence of memory dimms 25 configuring memory 28 testing memory 34 loading recovery capsule e4 entered dxe phase 12 starting application processor initialization 13 smm initialization 50 enumerating pci busses 51 allocating resourced to pci bus 92 detecting the presence of the keyboard 90 resetting keyboard 94 clearing keyboard input buffer 95 keyboard self test eb calling video bios 58 resetting usb bus 5a resetting pata/sata bus and all devices 92 detecting the presence of the keyboard 90 resetting keyboard 94 clearing keyboard input buffer 5a resetting pata/sata bus and all devices 28 testing memory 90 resetting keyboard 94 clearing keyboard input buffer e7 waiting for user input 01 int 19 00 ready to boot
93 5 regulatory compliance and battery disposal information what this chapter contains 5.1 regulatory compliance..................................................................... 93 5.2 battery disposal information........ .................................................... 101 5.1 regulatory compliance this section contains the following regulatory compliance information for desktop board DQ965GF: ? safety regulations ? european union declaration of conformity statement ? product ecology statements ? electromagnetic compatibility (emc) regulations ? product certification markings 5.1.1 safety regulations desktop board DQ965GF complies with th e safety regulations stated in table 47 when correctly installed in a compatible host system. table 47. safety regulations regulation title ul 60950-1:2003/ csa c22.2 no. 60950-1-03 information technology equipmen t ? safety - part 1: general requirements (usa and canada) en 60950-1:2002 information technology equipment ? safety - part 1: general requirements (european union) iec 60950-1:2001, first edition information technology equipment ? safety - part 1: general requirements (international)
intel desktop board DQ965GF tec hnical product specification 94 5.1.2 european union declaration of conformity statement we, intel corporation, declare under our sole responsibility that the product intel ? desktop board DQ965GF is in co nformity with all applicab le essential requirements necessary for ce marking, following the provisions of the european council directive 89/336/eec (emc directive) and council directive 73/23/eec (safety/low voltage directive). the product is properly ce marked demo nstrating this conformity and is for distribution within all member states of the eu with no restrictions. this product follows the provisions of the european directives 89/336/eec and 73/23/eec. ? e?tina tento vyrobek odpovd po?adavk ? m evropskych sm rnic 89/336/eec a 73/23/eec. dansk dette produkt er i overensstemmels e med det europ?iske direktiv 89/336/eec & 73/23/eec. dutch dit product is in navolging van de bepalingen van europees directief 89/336/eec & 73/23/eec. eesti antud toode vastab euroopa direktiivides 89/336/eec ja 73/23/eec kehtestatud n?uetele. suomi t?m? tuote noudattaa eu-direktiivin 89/336/eec & 73/23/eec m??r?yksi?. fran?ais ce produit est conforme aux exigen ces de la directive europenne 89/336/eec & 73/23/eec. deutsch dieses produkt entspricht den bestimm ungen der europ?ischen richtlinie 89/336/eec & 73/23/eec. ??????? ? ? ??? ??????? ?? ????? ?? ?????? ????? 89/336/ ?? ? 73/23/ ?? . magyar e termk megfelel a 89/336/eec s 73/23/eec eurpai irnyelv el ? rsainak. icelandic tessi vara stenst reglugere evrps ka efnahags bandalagsins nmer 89/336/ eec & 73/23/eec. italiano questo prodotto conforme a lla direttiva europea 89/336/eec & 73/23/eec. latvie?u ?is produkts atbilst eiropas direkt vu 89/336/eec un 73/23/eec noteikumiem. lietuvi ? ?is produktas atitinka europos direktyv ? 89/336/eec ir 73/23/eec nuostatas. malti dan il-prodott hu konformi mal-pro vvedimenti tad-direttivi ewropej 89/336/eec u 73/23/eec. norsk dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ eec & 73/23/eec.
regulatory compliance and battery disposal information 95 polski niniejszy produkt jest zgodny z postan owieniami dyrektyw unii europejskiej 89/336/ewg i 73/23/ewg. portuguese este produto cumpre com as normas da diretiva europia 89/336/eec & 73/23/eec. espa?ol este producto cumple con las norm as del directivo europeo 89/336/eec & 73/23/eec. slovensky tento produkt je v slade s us tanoveniami eurpskych direktv 89/336/eec a 73/23/eec. sloven? ? ina izdelek je skladen z dolo ? bami evropskih direktiv 89/336/egs in 73/23/egs. svenska denna produkt har tillverkats i enlighet med eg-direktiv 89/336/eec & 73/23/eec. trk?e bu rn, avrupa birli ? i?nin 89/336/eec ve 73/23/eec y?nergelerine uyar.
intel desktop board DQ965GF tec hnical product specification 96 5.1.3 product ecology statements the following information is provided to address worldwide product ecology concerns and regulations. 5.1.3.1 disposal considerations this product contains the following material s that may be regulated upon disposal: lead solder on the printed wiring board assembly. 5.1.3.2 recycling considerations as part of its commitment to environmental responsibility, intel has implemented the intel product recycling program to allow retail consumers of intel?s branded products to return used products to select locations for proper recycling. please consult the http://www.intel.com/intel/other/ehs/product_ecology/recycling_program.htm for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. ?????????? intel product recycling program ????????????????? ????? http://www.intel.com/intel/other/ehs/pr oduct_ecology/recycling_program.htm ????p??????? als teil von intels engagement fr den um weltschutz hat das unternehmen das intel produkt-recyclingprogramm implementiert, das einzelhandelskunden von intel markenprodukten erm?glicht, gebrauchte produkte an ausgew ?hlte standorte fr ordnungsgem??es recycling zurckzugeben. details zu diesem programm, einschlie? lich der darin eingeschlossenen produkte, verfgbaren standorte, versandanweisungen , bedingungen usw., finden sie auf der http://www.intel.com/intel/other/ehs/pr oduct_ecology/recycling_program.htm espa?ol como parte de su compromiso de responsabilidad medioambiental, intel ha implantado el programa de reciclaje de productos intel, que permite que los consumidores al detalle de los productos intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. consulte la http://www.intel.com/intel/other/ehs/pr oduct_ecology/recycling_program.htm para ver los detalles del programa, que incl uye los productos que abarca, los lugares disponibles, instrucciones de env o, trminos y condiciones, etc.
regulatory compliance and battery disposal information 97 fran?ais dans le cadre de son engagement pour la protection de l'environnement, intel a mis en ?uvre le programme intel product recy cling program (programme de recyclage des produits intel) pour pe rmettre aux consommateurs de produits intel de recycler les produits uss en les retour nant des adresses spcifies. visitez la page web http://www.intel.com/intel/other/ehs/pr oduct_ecology/recycling_program.htm pour en savoir plus sur ce programme, savoir les produits concerns, les adresses disponibles, les instructions d'expdition, les conditions gnrales, etc. ?Z ???ho??h???K? ?u???????m??u?? ??k?? u????s????? http://www.intel.com/intel /other/ehs/product_ecology/recycling_program.htm ?ZE malay sebagai sebahagian daripada komitmennya terhadap ta nggungjawab persekitaran, intel telah melaksanakan program kita r semula produk untuk membenarkan pengguna-pengguna runcit produk jenama intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. sila rujuk http://www.intel.com/intel/other/ehs/pr oduct_ecology/recycling_program.htm untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arah an penghantaran, terma & syarat, dsb. portuguese como parte deste compromisso com o respei to ao ambiente, a intel implementou o programa de reciclagem de produtos para que os consumidores finais possam enviar produtos intel usados para locais selecionad os, onde esses produtos s?o reciclados de maneira adequada. consulte o site http://www.intel.com/intel/other/ehs/pr oduct_ecology/recycling_program.htm (em ingls) para obter os detalhes sobr e este programa, inclusive o escopo dos produtos cobertos, os locais disponveis, as instru??es de envio, os termos e condi??es, etc. russian ???? ? ?? ????? ???? ?? , intel ???? ???? ?????? ??? intel (product recycling program) ?? ???????? ???? ?????? ?? ??? intel ????? ???? ????? ??? ??????????? ?? ?? ???? ?????? . ???? , ???? ? ?? - ?? http://www.intel.com/intel/other/ehs/pr oduct_ecology/recycling_program.htm ? ?????? ???? , ??????? ??? , ??? ??? , ???? ??? , ????? ??? . .
intel desktop board DQ965GF tec hnical product specification 98 trk?e intel, ?evre sorumlulu ? una ba ? ml l ? n n bir par?as olarak, perakend e tketicilerin intel markal kullan lm ? rnlerini belirlenmi ? merkezlere iade edip uygun ? ekilde geri d?n ? trmesini ama?layan intel rnleri geri d?n ? m program ?n uygulamaya koymu ? tur. bu program n rn kapsam , rn iade merkezleri, nakliye talimatlar , kay tlar ve ? artlar v.s dahil btn ayr nt lar n ?grenmek i?in ltfen http://www.intel.com/intel/other/ehs/pr oduct_ecology/recycling_program.htm web sayfas na gidin. 5.1.3.3 lead free desktop board this desktop board is lead free although certain discrete components used on the board contain a small amount of lead whic h is necessary for component performance and/or reliability. this desktop board is referred to as ?lead-free second level interconnect.? the board substrate and the solder connections from the board to the components (second-level connections) are all lead free. table 48 shows the various forms of the ?lead-free 2 nd level interconnect? mark as it appears on the board and accompanying collateral. table 48. lead-free board markings description mark lead-free 2 nd level interconnect: this symbol is used to identify electrical and electronic assemblies and components in which the lead (pb) concentration level in the desktop board substrate and the solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm). or or
regulatory compliance and battery disposal information 99 5.1.4 emc regulations desktop board DQ965GF complies with the emc regulations stated in table 49 when correctly installed in a compatible host system. table 49. emc regulations regulation title fcc class b title 47 of the code of federa l regulations, parts 2 and 15, subpart b, radio frequency devices. (usa) ices-003 (class b) interference-causing equipm ent standard, digital apparatus. (canada) en55022: 1998 (class b) limits and methods of measurement of radio interference characteristics of information technology equi pment. (european union) en55024: 1998 information technology equipment ? immunity characteristics limits and methods of measurement. (european union) as/nzs cispr 22 (class b) australian communications authorit y, standard for electromagnetic compatibility. (australia and new zealand) cispr 22, 3rd edition, (class b) limits and methods of measurement of radio disturbance ch aracteristics of information technology equi pment. (international) cispr 24: 1997 information technology equipment ? immunity characteristics ? limits and methods of measurement. (international) vcci (class b) voluntary control for interfer ence by information te chnology equipment. (japan) japanese kanji statement translation: this is a class b product based on the standard of the voluntary control council for inte rference from information technology equipment (vcci). if this is used near a radio or television receiver in a domestic environment, it may cause radio interf erence. install and use the equipment according to the instruction manual.
intel desktop board DQ965GF tec hnical product specification 100 korean class b statement translation: this is household equipment that is certified to comply with emc requirements. you may use this equipment in residential environments and other non-residential environments. 5.1.5 product certification markings (board level) desktop board DQ965GF has the product certification markings shown in table 50: table 50. product certification markings description mark ul joint us/canada recognized componen t mark. includes adjacent ul file number for intel desktop boards: e210882. fcc declaration of conformi ty logo mark for class b equipment. includes intel name and DQ965GF model designation. ce mark. declaring compliance to european union (eu) emc directive (89/336/eec) and low voltage directive (73/23/eec). australian communications authority (aca ) c-tick mark. includes adjacent intel supplier code number, n-232. japan vcci (voluntary control council for interference) mark. s. korea mic (ministry of information and communication) mark. includes adjacent mic certification number: cpu-DQ965GF for information about mic certification, go to http://support.intel.com/su pport/motherboards/desktop/ taiwan bsmi (bureau of standards, metrology and inspections) mark. includes adjacent intel company number, d33025. printed wiring board manufacturer?s reco gnition mark. consists of a unique ul recognized manufacturer?s logo, alon g with a flammability rating (solder side). v-0
regulatory compliance and battery disposal information 101 5.2 battery disposal information caution risk of explosion if the battery is replaced with an incorrect type. batteries should be recycled where possible. disposal of used batteries must be in accordance with local environmental regulations. precaution risque d'explosion si la pile usage est remp lace par une pile de type incorrect. les piles usages doivent tre recycles dans la mesure du possible. la mise au rebut des piles usages doit respecter les rglementa tions locales en vigueur en matire de protection de l'environnement. forholdsregel eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. batterier b?r om muligt genbruges. bortskaffels e af brugte batterier b?r foreg? i overensstemmelse med g?ldende milj?lovgivning. obs! det kan oppst? eksplosjonsfare hvis batteriet skiftes ut med feil type . brukte batterier b?r kastes i henhold til gjeldende milj?lovgivning. viktigt! risk f?r explosion om batteriet ers?tts med felaktig batterityp. batterier ska kasseras enligt de lokala milj ?v?rdsbest?mmelserna. varo r?j?hdysvaara, jos pariston tyyppi on v??r ?. paristot on kierr?tett?v?, jos se on mahdollista. k?ytetyt paristot on h?vi tett?v? paikallisten ymp?rist?m??r?ysten mukaisesti. vorsicht bei falschem einsetzen einer neuen batteri e besteht explosionsgefahr. die batterie darf nur durch denselben oder einen en tsprechenden, vom hersteller empfohlenen batterietyp ersetzt werden. entsorgen si e verbrauchte batterien den anweisungen des herstellers entsprechend. avvertimento esiste il pericolo di un esplos ione se la pila non viene so stituita in modo corretto. utilizzare solo pile uguali o di tipo equivalente a quelle co nsigliate dal produttore. per disfarsi delle pile usate, seguir e le istruzioni del produttore.
intel desktop board DQ965GF tec hnical product specification 102 precaucin existe peligro de explosin si la pila no se cambia de forma adecuada. utilice solamente pilas iguales o del mismo tipo qu e las recomendadas por el fabricante del equipo. para deshacerse de las pilas usad as, siga igualmente las instrucciones del fabricante. waarschuwing er bestaat ontploffingsgevaar als de batteri j wordt vervangen door een onjuist type batterij. batterijen moeten zoveel moge lijk worden gerecycled. houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. aten??o haver risco de explos?o se a bateria for su bstituda por um tipo de bateria incorreto. as baterias devem ser recicladas nos locais apropriados. a elimina??o de baterias usadas deve ser feita de acordo com as regulamenta??es ambientais da regi?o. a ? ciaro?zna ?? ?? ?? ?? , ??? ??????? ????? ???????? . ????? ???? , ?????? , ?????? . ????? ? ? ?????? ??? ???? ?? ?????????? ????? . upozornn v p ? pad vym ny baterie za nesprvny druh m ? ?e dojt k vybuchu. je-li to mo?n, baterie by m ly byt recyklovny. baterie je t ? eba zlikvidovat v souladu s mstnmi p ? edpisy o ?ivotnm prost ? ed. ????? ????? ?????? ?? ???? ? ????? ? ??? ????????? ? ? ??????? ?? . ? ???? ? ?? ? ????????? ?? ?? ???? ?? ???? . ????? ?? ????????????? ???? ?? ? ???? ????? ? ??? ?? ? ???|????????? ????????? . vigyazat ha a telepet nem a megfelel ? tpus telepre cserli, az felrobbanhat. a telepeket lehet ? sg szerint jra kell haszno stani. a hasznlt telepeke t a helyi k?rnyezetvdelmi el ? rsoknak megfelel ? en kell kiselejtezni.
regulatory compliance and battery disposal information 103 awas risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. bateri sepatutnya dikitar semula ji ka boleh. pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. ostrze ? enie istnieje niebezpiecze stwo wybuchu w przypadku zastosowania niew ? a ? ciwego typu baterii. zu ? yte baterie nale ? y w miar ? mo ? liwo ? ci utylizowa ? zgodnie z odpowiednimi przepisami ochrony ? rodowiska. precau ? ie risc de explozie, dac ? bateria este ?nlocuit ? cu un tip de baterie necorespunz ? tor. bateriile trebuie reciclate, dac ? este posibil. depozitarea bateriilor uzate trebuie s ? respecte reglement ? rile locale privind protec ? ia mediului. ??????? ??????? ???? ??????? ? ??? ? ? ??? . ???? ???? ? ???????? ????? . ?????? ???? ???? ??? ????? , ???? ??? ?????? . upozornenie ak batriu vymente za nesp rvny typ, hroz nebezpe ? enstvo jej vybuchu. batrie by sa mali pod ? a mo?nosti v?dy recyklova ? . likvidcia pou?itych batri sa mus vykonva ? v slade s miestnymi predpismi na ochranu ?ivotnho prostredia. pozor zamenjava baterije z baterijo druga ? nega tipa lahko povzro ? i eksplozijo. ? e je mogo ? e, baterije reciklirajte. rabljene bate rije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. . uyari yanl ? trde pil tak ld ? nda patlama riski vard r. piller mmkn oldu ? unda geri d?n ? trlmelidir. kullan lm ? piller, yerel ?evre yasalar na uygun olarak at lmal d r. o ? ?????? ???? ?????? ? , ???? ?????? ??? ??? . ? ????? , ?????? ???? ? ????? . ????? ??????? ???? ?? ? ?????? ???? ???? ? , ??? ? ????? .
intel desktop board DQ965GF tec hnical product specification 104

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